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Figure 1.30 A large network built from a number of smaller networks is usually a hybrid network, consisting of several different topologies as shown here.
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familiar with them being used as peripheral devices for PCs and as point-to-point communication devices, providing I/O functions for the computer, I think of them as network devices. When they are plugged into a PC, they go through an enumeration process similar to that of new nodes being connected to a network. They can be designed to operate independently of the PC, using the PC s USB port as a method of transferring data from the device to a PC application. This may be a rather unconventional way of looking at USB devices, but I nd that developing applications for them is much easier if this perspective is taken. This discussion on networks is quite simplistic and there are many topics I have not discussed in fear of getting bogged down in minutiae when the purpose of this chapter is to give you an introduction to the various concepts that are involved with creating embedded microcontroller applications. Later in the book, I will discuss the various issues required for designing network applications for the PIC microcontroller.
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There are quite a few packaging options you should be aware of that will affect the cost, size, robustness, and performance of the nal application. When I use the term device packaging, I am describing the methodology used to protect a chip and the interconnect technology used to connect it electrically to the printed circuit board (PCB, which I call the raw card) and other circuitry used in the application. Knowing which options are available will allow you to come up with a nal circuit that best meets the requirements of the application. The term encapsulation is used to describe the method of protecting the chip from the environment. There are two primary types used: plastic and ceramic. Plastic encapsulants are the most prevalent and use an epoxy potting compound to provide effective
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Figure 1.31 OTP packaging completely surrounds a chip with an impervious epoxy encapsulant.
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and inexpensive protection. Ceramic encapsulants are considerably more expensive (driving chip costs up as much as ten times over that of plastic encapsulated chips) and should only be considered when thermal or other considerations make its use mandatory. In the second edition of this book, the current technology required that PIC microcontroller ceramic chip packages be used for various applications. With the advent of Flash program memory, every application presented in this edition can be built using chips in plastic packages. Before the chip is encapsulated or packaged, it must be connected to a lead frame. The lead frame is a copper form that becomes the pins that come out of the package and connects the chip to the other circuitry in the application. The copper lead frame is wired to the chip via very thin aluminum wires ultrasonically bonded to both the chip and the lead frame. During encapsulation, the lead frame is used to handle the chip and the encapsulant while it is hardening. Plastic packaging is often referred to as one-time programmable (OTP, see Fig. 1.31) packaging due to its historic relationship with EPROM program memory. Earlier in the chapter, I described EPROM program memory as being erasable when exposed to ultraviolet light. To allow a chip to be erased, a package with a window to allow the light to pass through has to be used, but there are applications where EPROM is the best choice and there is no need to reprogram it. The chip was therefore put into a plastic encapsulation and labeled one-time programmable because once the EPROM was programmed, it could never be changed. This term has continued to be used with all PIC microcontrollers built with plastic packaging (and many other chips besides). The primary purpose of putting an embedded microcontroller into a ceramic package is to allow a quartz window to be made available for the purpose of erasing the EPROM program memory (Fig. 1.32). When a ceramic package is used, the chip is glued
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Figure 1.32 Windowed ceramic packaging allows a chip to be exposed to ultraviolet light to erase its EPROM program memory.
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