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PIC MCUs are available in a variety of packaging, as can be seen in the following gures, which illustrate the packages as well as the letter codes that specify them. Fig. 2.4 shows the one-time programmable (OTP) packages that you will be using when you are rst learning about the PIC microcontroller. The term OTP became popular when programmable parts (which are normally in windowed ceramic packages, like the ones shown in Fig. 2.5) were built in solid plastic packages. The reason for doing this was the much lower cost of the plastic packaging and the expectation that the part would never be reprogrammed (which requires the availability of a window for ultraviolet light to erase the EPROM memory on the chip). PIC microcontrollers with EEPROM and Flash program memory that are put into solid plastic packages,
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PIC MICROCONTROLLER FEATURE SUMMARY
Figure 2.4 Plastic dual in-line (DIP) OTP packages.
like the ones shown in Fig. 2.4, do not require ultraviolet light to be erased and are still identi ed as OTP. While you will learn how to wire into an application circuit using pin-through-hole (PTH) parts like the ones shown in Figures 2.4 and 2.5, you will probably never use these
Windowed ceramic PIC microcontroller packages.
THE MICROCHIP PIC MICROCONTROLLER
Standard plastic surface mount packages.
parts in products because of their size compared to surface mount technology (SMT) parts and the requirement for a solder wave to attach them to a PCB. Standard SMT packages are shown in Fig. 2.6 and the ne pitch lead devices are shown in Fig. 2.7. Unpackaged chips are available for some parts from Microchip for use in chip-onboard (COB) applications. In these cases, the chips are said to be available in waf e pack for automated chip pickup and placement.
Fine pitch plastic surface mount packages.
PIC MICROCONTROLLER FEATURE SUMMARY
Each package has a one- or two-letter code that is put at the end of the part number to describe which package the chip is in. These codes are listed in Figures 2.4 to 2.7, along with the package description. For example, the 16F84 is normally sold as a PIC16F84P, which indicates the 16F84 has a plastic, dual in-line package (DIP).
PART NUMBER CONVENTIONS AND ORDERING
Determining which part number to specify when ordering a PICmicro for an application or product is very consistent across the entire line. Fig. 2.8 shows the conventions for how the part numbers are speci ed by Microchip. The PIC microcontroller chips described in this book are all 8-bit parts and will start with the ve-letter groups PIC10, PIC12, PIC14, PIC16, PIC17, and PIC18. When you look at Microchip catalogs, you will also see dsPIC and PIC30 pre xes for microcontrollers. These parts are digital signal processors and 16-bit MCUs and will not be described in this book. Note that Fig. 2.8 probably does not have all the possible part number options for parts released after publication of this book. The datasheet for the part number will have speci c information about the packages the chip is available in, including dimensional information and PCB footprint information for some parts.
LETTER SUFFIXES
When you look for a speci c PICmicro part number, you may discover that you have more than one part to choose from. For example, there are three versions of the 16C73 available: the PIC16C73, the PIC16C73A, and the PIC16C73B. The letter suf xes indicate
PIC microcontroller part number de nition.
THE MICROCHIP PIC MICROCONTROLLER
different versions of the part, but documentation on the differences is often very sketchy and will seem incomplete. Microchip, like many other integrated circuit manufacturers, continually tracks the quality of their products as well as their conformance to speci cations. They are also continually replacing their manufacturing equipment with newer tools that are capable of producing better quality chips with smaller device dimensions. The quality information and manufacturing process improvements make the updating of parts attractive in a variety of situations. These updates are the new letter suf xes that you will see in catalogs. These suf xes represent an entirely new chip design (often referred to as a respin). Microchip continually updates their parts to use smaller chips as well as eliminate the use of circuits that have proved to be unreliable in manufacturing. The function (speed and features) of the part is never changed in these revisions, lest compatibility with previous versions of the device is lost. For the most part, different letter codes of the same PICmicro part number will work in an application, regardless of what its suf x letter is. Even though I ve mentioned product quality as a driver in implementing a respin, it is not the main driver. The main reason for carrying out a respin is to provide smaller chips that perform the same function. Smaller chips bring two advantages to Microchip: power reduction and part cost reduction. Power is reduced as the part is shrunk. The longer the path an electron has to travel, the greater the overall resistance it will encounter. By reducing the distances electrical currents have to travel on the chips, the resistances (which are the cause of power dissipation within the chip) are reduced. It may be surprising that redesigning a part reduces its cost, but even a small reduction in part size can have huge cost advantages for a chip manufacturer. In chip manufacturing, cost is directly related to the number of wafers required to build a speci c number of chips. By increasing the number of chips on a wafer (by decreasing their size), the number of chips produced by the manufacturing process will increase without a signi cant increase in cost.
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