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WASTE MANAGEMENT GOALS AND OPPORTUNITIES
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Technicians are generally more experienced workers who troubleshoot production problems and make equipment adjustments and repairs. They take the lead in assuring quality control and in maintaining equipment. They also test completed chips to make sure they work properly. To keep equipment repairs to a minimum, technicians perform diagnostic analyses and run computations. For example, technicians may determine if a aw in a chip is due to contamination and peculiar to that wafer, or if the aw is inherent in the manufacturing process.
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33.2 Waste Management Goals and Opportunities
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The majority of solid waste generated by this sector is paper, plastics, and metals. Table 33.1 displays the composition breakdown based on survey results.
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TABLE 33.1 ELECTRONIC- AND SEMICONDUCTOR-MANUFACTURING INDUSTRY SOLID WASTE COMPOSITION (SURVEY RESULTS) MATERIAL COMPOSITION (%) RECYCLING (%)
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Paper Mixed of ce paper Newspaper Paper (other) Plastics LDPE PP PS HDPE PET Metals Ferrous metals Nonferrous metals Aluminum cans OCC (cardboard) Wood Food waste Glass Chemical Yard waste Other Overall recycling level
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28 23 3 2 21 7 4 4 3 3 17 11 4 2
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2.6 2.4 0.4 0.2 3.5 2.2 1.2 1.2 0.9 0.9 4.1 3.9 2.1 0.8
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16 17 6 0 41 42 39 38 42 41 99 99 99 41
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5.4 5.8 2.0 0.0 15.2 15.2 15.6 14.9 14.2 17.2 13.1 13.1 13.1 11.0
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8 1.4 7 1.3 6 1.7 3 0.9 1 0.8 1 0.4 8 N/A
71 24.1 47 16.0 0 0.0 7 2.4 14 4.8 0 0.0 0 0.0 39.2
ELECTRONICS, SEMICONDUCTORS, AND OTHER ELECTRICAL EQUIPMENT
As shown in the table, the recycling rate for this sector is approximately 39 percent. As derived from the solid waste evaluation model discussed in Chap. 12, the equation that estimates the annual waste generation per year per employee for this sector can be calculated from the following:
Tons of solid waste generated per year = 2.29 number of employees 0.83 solid waste disposal cost per ton 56.31 if the company is ISO 140001 certi ed + 126.6
33.3 Constraints and Considerations
Due to their hazardous material contents, electronic and electric equipment waste may cause environmental problems during the waste management phase if it is not properly pretreated. Many countries have drafted legislation to improve the reuse, recycling, and other forms of recovery of such wastes so as to reduce disposal. The waste streams generated from electric and electronic manufacturing, being a mixture of various materials, can be regarded as a resource of metals, such as copper, aluminum, and gold. Effective separation of these materials based on the differences on their physical characteristics is the key for developing a mechanical recycling system. Therefore, an in-depth characterization of this speci c material stream is imperative. Major hazardous components in waste electric and electronic equipments and their description:
Batteries Heavy metals such as lead, mercury, and cadmium are present in
batteries. Cathode ray tubes (CRTs) Lead in the cone glass and uorescent coating cover the inside of panel glass. Mercury-containing components, such as switches Mercury is used in thermostats, sensors, relays, and switches (e.g., on printed circuit boards and in measuring equipment and discharge lamps); it is also used in medical equipment, data transmission, telecommunication, and mobile phones. Asbestos waste Asbestos waste has to be treated selectively. Toner cartridges, liquid and pasty, as well as color toner Toner and toner cartridges have to be removed from any separately collected waste electrical and electronic equipment (WEEE). Printed circuit boards In printed circuit boards, cadmium occurs in certain components, such as surface mounted device (SMD), chip resistors, infrared detectors, and semiconductors. Polychlorinated biphenyl (PCB) containing capacitors PCB-containing capacitors have to be removed for safe destruction. Liquid crystal displays (LCDs) LCDs of a surface greater them 100 cm2 have to be removed from WEEE.
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Plastics containing halogenated ame retardants During incineration/combustion
of the plastics halogenated ame retardants can produce toxic components. Equipment containing Chloro uorocarbons (CFCs) Present in the foam and the refrigerating circuit must be properly extracted and destroyed. Gas discharge lamps Mercury has to be removed. The manufacturing process for semiconductor devices is a complex operation that involves physical and chemical processes such as: oxidation, photolithography, etching, doping, and metallization. These processes generated solid wastes, usually in the form of contaminated metals.
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