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and EMC, provided all critical conductors are buried (lands only) on outer layer(s) of the printed board assembly. Separation of Grounds. The identification and separation of natural groupings of grounds into similar requirements increases the assurance of conformance to product definition requirements. Some of the natural groupings are as follows:
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Electrical safety ground Power supply ground Low-level analog ground High-level analog ground Digital ground I/O ground Pulsed power/energy ground
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When defining the printed circuit design requirements for a particular assembly, results of an analysis of the grounding elements necessary for proper functional performance must be included. 15.5.3.3 Bypass Capacitors. The selection, location, number, and value of the bypass capacitor(s) for PCDs can affect functional circuit performance. The purpose of the bypass capacitor is to provide the necessary electrical energy to minimize the effect of a component s normal transient switching and load currents during functional operation. The selection, location, and placement of the bypass capacitor can have a significant impact on EMC and a lesser impact on functional performance. One of the keys to EMC management is to prevent or minimize the generation and subsequent radiation of electromagnetic fields in the first place. 15.5.3.4 Voltage and Ground Buses. As operating frequencies and speeds increase, voltage and ground bus distribution systems may function as lump constant shock-excited oscillators. The frequency of oscillation is dependent on the series inductances of the voltage and ground bus system and shunt capacitors. One of the worst cases is when the voltage and ground buses are placed as railroad rails with the bypass capacitors, and digital integrated circuits are alternated in position like railroad ties bridging between the rails. 15.5.3.5 Voltage and Ground Planes. Voltage and ground planes can be an effective means to provide a relatively low resistance and impedance1 to distribute voltage and ground within a PBD. However, maximum effectiveness solid metal, with no holes or cutouts for plated through-holes or other necessary features is an unobtainable condition. Therefore, voltage and ground planes are a compromise in design and requirements due to the necessary holes in the planes for electrical interconnections and component mounting. Voltage and Ground Plane Resistance. The sheet resistance of solid copper voltage and ground planes is relatively low for most copper foil thicknesses. For 35-mm-thick copper foil, the dc (solid) sheet resistance is less than 1 m /sq. The dc resistance of copper foil is shown in Eq. (15.2). The (solid) sheet resistance for selected copper foils is shown in Table 15.3. Due to the almost infinite number of possible variations in the size, placement, and shape of perforated mesh planes, the following data are presented for informational and comparative purposes only. RDC = 17.2 m /sq tm m (15.2)
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t m m is in mm
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TABLE 15.3 Solid Area Copper Foil Sheet Resistance Copper thickness, mm 5 9 12 17 26 35 70 Sheet resistance, m /sq 3.44 1.911 1.433 1.012 0.662 0.491 0.246
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Resistance models for periodic mesh grid planes2 is of interest for uniform grids, but is of limited use for grid planes that are not periodic and for ac electrical network analysis. Voltage and Ground Plane Impedance. The impedance of perforated mesh voltage and ground planes is difficult to perform due to the number of variations in the size, placement, and shape of perforated mesh planes.
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The design intent of PBs and their assemblies is primarily to mount and lend mechanical support to components as well as to provide all of the necessary electrical interconnections. However, PBAs should not be used as a (major) structural member. There are three general forms of PBAs: 1. Functional module A plug-in and a mechanically mounted PBA. The functional module is in the form of a component, whereby leads or other types of electrical terminals provide both electrical interconnections and mechanical mounting of the module to the next higher level of electronic packaging. 2. Plug-in module This provides all of the necessary electrical interconnections at one or more edge-board connectors. A plug-in module typically plugs into a mother board, or sometimes electrical cables are used.The plug-in module is mechanically supported on one edge by the edge-board connector and on one or more edges by card guides, rails, or a mounting frame. 3. Mechanically mounted PBA This is mounted and/or supported in a mechanical assembly or housing with a number of mechanical fasteners around its periphery (and internally to the PBA for additional support, if required). The most common mechanically mounted PBA is the mother board, such as is frequently used in personal computers. Mechanically mounted PBAs are one of the members of an electrical/electronic assembly and are physically mounted in the assembly using one or more mechanical fasteners, such as screws, clips, and standoffs. A common example of a mechanically mounted PBA is a modular power supply. All forms of PBAs have many common requirements necessary to meet their product definition requirements, although there will be significant variations in the product definition requirements for PBAs due to their specific form and application requirements. For example, the requirement for PBA flatness due to bow and twist may be different for a plug-in than for a mechanically mounted PBA. The requirements for the number and location of mounting fasteners for a mechanically mounted PBA will be different for a relatively thick MLB with low-mass components than for a simpler PB with high-mass components.
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