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Despite these problems, this method is far superior to self-learning, digitizing, or drill file extraction, and remains in common use in a variety of software packages. The data requirements to start from this format include:
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Photoplot files for each layer, solder mask layers, etc. Photoplot files for silk screen legend(s) (required for computer-aided repair) Aperture file Drill file Board outline
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37.5.3.2 CAD/CAM Data Extraction Method. Recognizing the problems inherent in photoplot extraction, system vendors have agreed to add support for test-oriented output formats, in particular IPC-D-356 and 356A. These formats provide data in a much more readily digested format, and eliminate most ambiguities in processing the data. These formats include the following data:
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Signal ID, network name, and/or network number Reference designator or PIN number (e.g., U14, 12, R11) for the related component on board X-y coordinate of pad center (minimum data set requirement if grouped as connected) Pad dimensions relative to the center, and size of the hole (if any) Resistor or other component values (if appropriate and not usual) Board side (top or bottom) Mid-network flag suggesting that test point placement may not be required.
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Often this data set is converted to a standard such as IPC-D-356 from the CAD/CAM system s internal data formats by means of an intermediate converter. These software converters, although simple, are usually customized for each individual CAD system. A converter must be updated or modified with any output changes made by a CAD vendor due to a CAD system software update or new product introduction. The number of converters required by an independent PWB manufacturer could be quite high, as data will likely be received from many different CAD system types. Fortunately, many of the CAD vendors now include direct output of IPC-D-356 data or readily provide converters. Acceptance of these standards is now such that in many cases even Gerber input data are first converted into IPC-D356 format prior to final processing. 37.5.4 Outputs from Data Extraction Once all the preparation steps and processes have been performed, there are several outputs generated by the fixture software.
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Test file A data-driven test program is outputted in a format compatible with the test system type. This file informs the test system of the measurements expected and of pass/fail criteria. Some test system formats permit the data-driven test program to support a graphical representation of the fixture and/or board on the test system monitor, provided that sufficient data are included in the test program file. This graphical presentation is useful in fixture and/or program debugging. Fixture fabrication files Probably the most significant output the drill files, one for each plate or pass required by the fixture design is needed in drilling to start building the fixture. (In the case of wired fixtures, a wiring list is also required.)
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Repair/verification files Files can also be outputted that support the repair or verification function. These relate the graphical image of the board to the assigned test point locations in the program. Preparation often relies on inclusion of Gerber data in the input data stream to the software system. Extensions to IPC data formats are planned to better support the repair function without this recourse to photoplot data. Some test systems may carry trace image information in the test program file as well, for enhanced debugging support on the test system.
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Setting Up a Fixture With the fixture assembled and CAD data derived program prepared, the next step is to set up the fixture on the test system and validate the fixture and program. Details vary with the fixture and system used, but in general the following steps are taken:
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Program data are loaded into the test machine from the disk or network. Test thresholds are set to the desired continuity and isolation values. Compression settings on the test system are adjusted to the proper values for the fixture type. In some cases, these values may already be included in the test program file. The new (or recalled to duty) fixture is compressed with a nonconductive material of similar thickness to the board being tested. An all-isolations version of the test program is executed to verify that the fixture does not contain any internal shorts. The fixture is then compressed again with a conductive plate in place of the product, intentionally shorting all fixture test points together. Often this plate is a simple piece of copperclad G-10. Copper oxidation can prevent reliable contact, and users sometimes wrap the plate in fresh aluminum foil or use a flash-gold-covered plate. In this step, an all-shorts version of the test program verifies that all expected test points are continuous through the fixture, up to the shorting plate. The intent is to verify that the number of test points is correct and that, under multiple compressions or closures, all points are present and remain in contact with the shorting plate. Assuming proper alignment and cleanliness, the product can then be tested with the final test program. If certain errors immediately repeat on all boards, then it is reasonable to suspect a pin-loading error or other error in the fixture, and investigation is warranted.
The basic techniques just described are generally applicable to all fixture types, whether tilt pin, wired-dedicated, or other specialized types. Do not underestimate the value of removing dust and debris from the product and fixture, both during setup and occasionally during operation. Target sizes on modern products are not tolerant of debris, and false open circuit reports are an immediate result.Tacky roller-type cleaning systems may be helpful in periodically removing debris from test fixtures, system grids, and the products themselves. Follow the test equipment manufacturer s recommendation regarding the use of electrostatic discharge (ESD)-safe cleaning materials near the test system. Adjustment of fixture compression is also important, especially on press-type systems where the amount of compression stroke is controllable. (In vacuum fixtures, the dimensions of various fixture plates and components usually fix the amount of compression.) Undercompression usually leads to poor contact and false open results. Overcompression can cause excessive marking of the product by probe tips, probe damage, and fixture damage. Overcompression is a very common problem, and, unfortunately, so is product damage in the form of excess probe marking. It seems intuitive to just press harder when you experience contact problems, and this is often the first step taken. But the actual change in force per spring probe is very small as it travels further, until the spring probe hits bottom and at that point you begin damaging the product almost immediately. A typical spring probe in a grid system
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