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Selecting Fixture Software Today s tilt-pin translator fixture is largely a software product. It should be possible for you to establish a flow of information from your computer-aided manufacturing (CAM) department to the front-end fixture software that automates the design of fixtures and the creation of test programs. (The same goal holds true for processing data to create flying-probe test programs.) A premium tool will pay for itself many times over in reduced fixture scrap, reduced late deliveries, and elimination of test escapes. If you can select a tool that is also used by several fixture outsourcing vendors, you will have a backup supply of fixtures in the event of equipment problems, personnel problems, or workload peaks. If you have special and specific demands for the fixture design, verify that the proposed software package readily supports your requirements. And, as in the case of the test system, evaluate the software vendor s ability to sustain and support your operations.
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39.1 INTRODUCTION
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Printed circuit technology is now being applied to high-density interconnection (HDI) applications that require consideration of new testing techniques. Notable examples include many types of advanced integrated circuit (IC) packaging introduced in recent years, such as area-array devices, ball grid arrays (BGAs), laminate chip carriers (LCCs), and circuit boards employing direct chip attach (DCA) or chip-scale packages (CSPs). In some of these cases, semiconductor dies are being directly attached to a printed circuit surface, and in the case of CSP, the package size is approximately the same as a raw die. Flip-chip die (or CSPs) may be attached to a circuit board by an array of solder balls. Other devices may attach with a peripheral array of wirebond pad sites just outboard of the die area. For high-pin-count devices, this last example can produce the finest side-to-side test-point pitch as efforts are made to squeeze a large number of contacts onto the limited periphery of the die. The flipchip or CSP bump array attachment parts generally produce the highest test-point density per unit area. The flip-chip or CSP approaches allow the designer to distribute the solder ball contacts over the full surface area of the die or package. For fixtured test systems, the ability of the tester to provide a sufficient density of test points and the ability of the fixture to achieve the needed pitch and accuracy must be considered. The general goal of electrical testing for HDI substrates remains about the same detection of opens, shorts, and leakage, although often with increased concern for latent defects, whose appearance can be made more likely by the fine geometry employed in traces and microvias. The measurement electronics are often the same, and are not further discussed here except for special cases. For some applications, time domain reflectometry (TDR) or other radio frequency (RF) tests are desired, but are complicated by the short signal runs on some of these substrates. Sensitivity to pad marking is increased as there is not much pad area to mark. Marking that penetrates the metallization layers on the board can affect the chemistry of the solder joint, adversely impacting reliability. It is quite challenging to prepare test fixtures able to test such products on universal grids given the need to minimize witness marks, meet
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aggressive continuity test threshold expectations, and contact the finest geometries. When HDI parts are tested in panelized form, the very small target sizes combine with potential expansion/contraction issues in the panel construction to place a maximum demand upon test-point positional accuracy within the fixture. The ability of the latest camera-equipped flying-probe systems to locate these targets individually and probe them without marking combines with the fixture cost savings to make this method of test very attractive, especially as new techniques improve throughput (see Sec. 39.4.3). Because of the high costs associated with HDI fixtures, some fixtured solutions compromise test coverage such that the fixture can be simplified to a practical degree.
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