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Design Considerations The design of a surface-mount circuit board requires the consideration of three factors pertaining to the assembly process. First, there is a wide variety of solder-joint configurations for the different package types. Second, higher board densities can lead to upward of several tens of thousands of solder joints being fabricated at one time. Third, component miniaturization, as well as the unexposed solder joints of area-array packages, further diminishes the viability of performing repair or rework activities to correct solder-joint defects. A number of design rules are printed in documents (e.g., IPC SM-782 and D-330) that govern the size and location of bond pads. Surface-mount circuit boards are at least double-sided and, in most cases, multilayer, so that board design also must consider the interior of the laminate where vias are placed to conduct signals between the layers and surfaces. Assembly requirements also place constraints on the circuit board layout. A very high part density requires a large number of apertures in the solder paste stencil, which can cause the stencil to become locally too flimsy to control the solder paste deposit. A surface-mount circuit board with a very wide range of component sizes and package configurations may require multi-thickness stencils to properly control the paste deposit. Solder paste printing quality is a determining factor in solder-joint defects observed after the reflow process. The layout design of the surface-mount circuit board is a factor in the optimizing of the time-temperature profile used in the reflow process. Two important factors are overall thermal mass of the circuit board, determined primarily by the board thickness and number of internal layers as well as the variety package sizes and materials that can lead to temperature gradients as large as 20 C between the smallest passive devices and larger ball grid array packages over the board surface. Also, double-sided circuit boards require two reflow processes. Therefore, larger components should be placed on the side of the circuit board that is soldered last. If placed on the first side to be soldered, large packages may fall off of the board when the circuit board is upside down for the second side s soldering step, unless those devices are secured in place with an adhesive or staking compound. The design of a printed circuit board for Pb-free assembly must consider the same points as are considered for Sn-Pb technology, but with a greater emphasis placed on the effects of higher process temperatures e.g., temperature gradients between components across the circuit board. Foremost, there are the enhanced temperature gradients that may be created across a large circuit board having a high mixture of different component sizes and shapes. In the case of a mixed-technology product, there may be limitations placed on the maximum substrate thickness due to the less-solderable Pb-free alloys. It may also be necessary to limit via aspect ratios (typically remaining less than 10:1) to prevent immediate damage (defects) by the reflow process or a loss of long-term reliability.
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Assembly Processes The basic assembly process sequence for surface-mount technology is (1) solder paste printing, (2) pick and place of components, and (3) reflow of the solder. The assembly process is complicated when through-hole components are combined with surface-mount devices on the same circuit board; this is the previously mentioned mixed technology. In general, hand assembly of surface-mount boards is not always practical given the small size of passive devices and hidden solder joints of area-array packages. The use of hand soldering for repair and rework activities is limited by these same factors. This section lists the sequence of process steps for the different circuit board categories.The term top side has typically referred to the side with the greatest density of components and/or where the larger, active device packages are clustered together. As the functionality of printed circuit board products increases, these physical distinctions between the two sides have become less obvious. Therefore, the circuit board sides are simply given a designation: A or B.
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