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quantity of adhesive that fills the orifice and small cylinder at the top of the orifice. This suction step works best with low-viscosity fluids. It is difficult to pull up relatively high-viscosity materials such as solder paste and some adhesives. Next, the piston moves downward into the cylinder, forcing an exact amount of adhesive out the nozzle and onto the printed circuit board. This technique consistently produces the same volume of material. Besides the dimensions of the cylinder as well as the speed that the piston displaces, the viscosity of the adhesive also affects the dispensed quantity. Shelf-life specifications should be strictly enforced. The primary objective in each of the five dispensing techniques is to deposit consistently a specific quantity of adhesive or solder paste at each designated site. Too small of a quantity of adhesive, especially dot height, can fail to attach the part to the board. Too much adhesive causes it to run on to the solder pads, degrading solderability. In the case of solder paste, an insufficient quantity of paste will cause an incomplete joint or, in the worst case, an open circuit. An excess of solder paste results in a fillet that is difficult to inspect for solderability or risks formation of short circuits between neighboring interconnections. 40.3.3.3 Component Placement. The purpose of the component placement machine also called the pick-and-place machine is to select the proper component, orient it correctly, and then place it on the circuit board, all with degrees of accuracy and precision that minimize defects on the finished product. In addition, the component must be placed on the printed solder paste, the dispensed adhesive, or a combination of the two deposits with a controlled pressure or release distance that does not excessively spread out either material or damages the component package. Moreover, the placement machine must execute these tasks as quickly as possible in order to maximize the production volume. Lastly, the equipment must be sufficiently versatile to address continually changing electronic packages, specifically dimensions and I/O configurations. The change to Pb-free solders does not have an explicit impact on component placement machine technology. Indirectly, however, the need for alternative surface finishes on both the components and circuit board fiducials, which have different reflectance characteristics, can affect the performance of the vision systems used to locate accurately both the circuit board and the tooling that delivers the component to the board. Several machine types are available. The turret-style chip shooter and the gantry-style or flexible fine-pitch (FFP) machines have both been used extensively in the assembly of consumer electronics, telecommunications, mainframe and server computers, as well as for lower volume, high-reliability electronic products. However, the demands for even higher production volumes as well as the flexibility to change product lines rapidly have caused manufacturers to consider alternative machine architectures that include high-speed stepper motors and optical sensors as well as highly parallel methodologies that place multiple components at the same time. 40.3.3.3.1 Turret Systems (Passive Devices). The basic turret or chip shooter has been used to place passive components (i.e., capacitors, resistors, etc.) since the early development of surface-mount technology. A photograph of the turret head and schematic diagram of its operation are shown in Fig. 40.20. Multiple heads are positioned around a stationary, horizontally rotating turret.A moving feeder carriage positions tape feeders that deliver a component to each head. After the part is located in the head, the turret rotates it to a vision processing station where a charge coupled device (CCD) camera acquires an image of the part. This image is processed so that the part will be precisely located over the circuit board location. As the turret continues rotating, a moving table positions the printed circuit board so that the target location is in position under the turret head to receive the component. The part is lowered to the circuit board and released. The head rotates to acquire another component, and the cycle repeats itself. Listed in Table 40.3 are general performance characteristics for turret chip placement technology. This technology is constantly addressing smaller passive devices (0101 and 01005) as
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