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The introduction of Pb-free solder technology does not, in and of itself, alter the previously described principles with regard to assembly-line architectures. The equipment is very similar and the factors that determine an optimum line configuration remain unchanged. Instead, consideration must be given to the cost/benefit of having an entirely separate assembly line that is dedicated to Pb-free products. In the case of wave soldering, the need for a second line is intuitive; it is simply not practical to empty and refill the solder pot with different alloys from both a process time-management point of view as well as the metallurgical-based concern of mixing the two alloys. An interim approach is to exchange only solder pots in the machine, ensuring that all residues of the previous solder have been removed from all equipment surfaces. However, even in the case of solder paste printing and reflow soldering, many manufacturers have determined that two separate assembly lines are required, even to the extent of physically locating them at separate locations in the plant. There are simply too many risks associated with potentially mixing the two assembly technologies, particularly in high-volume operations where a significant quantity of product may be built before an error is recognized. The potential mix-ups include:
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Use of the incorrect solder paste Placement of components with the incorrect surface finish Pb-Sn (high-reliability electronics) versus 100 percent Sn (consumer electronics) Incompatible moisture sensitivity levels (MSLs) of plastic molded components Vision system settings for identifying fiducials of alternative surface finish Reflow furnace settings for the different time-temperature profiles
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ODD-FORM COMPONENT ASSEMBLY
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An accurate definition of an odd-form component is one that cannot be placed and/or soldered with equipment available in the assembly line. The likelihood of having to address an odd-form component is actually quite high. Because of the wide range of current component technologies as well as those expected in the future whether through-hole or surface-mount there is always the chance that a package cannot be placed or soldered in the assembly line. Certainly, if volumes warrant, new equipment can be purchased, or special tooling made, for adapting the placement and/or reflow equipment for odd-form components. However, there is a significant cost penalty to this approach, especially if it is performed for a variation of sizes and configurations. Each package variation would require separate tooling designs or equipment modifications. However, the advantages of automating odd-form assembly operations include a higher production volume as well as fewer defects resulting from the automated rather than manual operations. Therefore, it is not unusual for odd-form component assembly to be a mix of both manual practices as well as automated techniques. Generally, the introduction of Pb-free soldering affects odd-form components in a manner not unlike that for other surface-mount and through-hole components. The two primary issues are I/O surface finishes and temperature sensitivity of each component s material set. Highreliability applications have to monitor components for 100 percent Sn finishes. Because oddform components often fit this category due to a large size, hot Sn-Pb solder dipping is a more viable option to remove the 100 percent Sn finish. Otherwise, the tracking of incoming material and verification of the actual surface finish may be required. Temperature sensitivity of devices will have to be documented in terms of surviving the Pbfree reflow profile. In fact, some devices that were previously processed on a Sn-Pb assembly line may have to be set aside as odd-form components because they cannot be exposed to the Pb-free process temperatures. Another risk of the higher-processing Pb-free reflow temperatures is the damage to moisture-sensitive components. The typical Pb-free time-temperature profile adds one or two MSLs to a component.Therefore, devices at MSL levels 5 or 6 per a Sn-Pb profile may have to be assembled to the circuit board in a separate operation to avoid damage, thus causing them to be odd-form components.
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