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Components Connectors comprise approximately 75 to 80 percent of odd-form components. See Fig. 40.6. For example, there are universal serial bus (USB) connectors, dual inline memory module (DIMM) connectors, phone jacks, and zero-insertion-force (ZIF) connectors, as well as a variety of surface-mount connectors. Other odd-form components include sockets, electrolytic capacitors, transformers or large inductors, LEDs, relays, switches, as well as speakers and vibrators for handheld communications devices. In surface-mount technology, odd-form components are most often through-hole packages, including both passive and active devices as well as connectors. When addressing such odd-form components, the first step is to check the availability of an equivalent surface-mount version since there has been a shift toward surfacemount versions of many of these devices. Of course, the materials used to construct the surface-mount replacement must survive the reflow furnace environment, and especially the Pb-free reflow temperatures, particularly connectors because of their complex internal construction. In some cases, it has been possible to replace the through-hole connector with one of a variety of solderless products. Also, it is not necessarily size or weight that causes a component to be identified as oddform per the particular assembly line. Temperature-sensitive and moisture-sensitive devices may also be excluded from a reflow step of the assembly process to prevent damage to them. The latter scenario is of particular concern when converting from a Sn-Pb to a Pb-free process. DCA refers to the assembly of an unpackaged active semiconductor device directly onto the circuit board. The interconnections are made either by wirebonding or by solder bumps on the front side of the die. The latter application is referred to as FC attachment and can be implemented into a surface-mount assembly process as long as existing equipment can accommodate the placement accuracy required for the very small solder bumps and pads. Otherwise, a dedicated cell may be required. The DCA process, which uses wirebond interconnections, is based on the following steps. First, an adhesive is dispensed on the board and the die placed on it. The adhesive, which is often thermally conductive for heat management, is cured. The I/O pads on the die are wirebonded to the appropriate pads on the circuit board. Then, the die and wire bonds are encapsulated in an epoxy to prevent damage to them. The encapsulant, or glob top, is then cured. Critical to the glob top technology are the following factors: complete coverage of the die and wire bonds with minimal run-out beyond the circuit board pads; adequate adhesion between the die and circuit board; and good adhesion between the encapsulant and the circuit board beyond the perimeter of the die.
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40.4.2 Manual Assembly In the least complicated format, only an operator places the odd-form components on the circuit board. The soldering process is automated in that the operator picks components from bulk bins and repeatedly positions them onto the circuit board as it is carried along the conveyor line. For paste-in-hole assembly, the solder paste and other components (surface-mount or through-hole) may already be on the board, being held in place only by the tackiness of the paste. Therefore, the operator must not inadvertently displace other components off of their sites during handling. Also, the operator must pay special attention to handling and ESD damage while placing components. Also, those components that incorporate snap-in features (e.g., connectors) can require that the operator exert relatively high forces on the circuit board. Thus, the operator must not damage either that component or other components and the circuit board. Often, special tooling is used to press snap-in components on the circuit board to prevent such damage. A large number of applications require the operator to place and then manually solder the odd-form component into place, often after the other components have been soldered into place.The operator must be cognizant of handling and ESD damage as well as prevent thermal damage or the inadvertent reflow of solder joints for neighboring components. The impact of
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