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now be taken outside the scope of the original assembly process, yet achieve the same quality without ancillary damage to components, circuit boards, or other solder joints. A further complication to the rework procedure performed on either post-assembled or field-return hardware is the use of adhesives or staking compounds to anchor the device to the circuit board. Because many adhesives used for this purpose are thermosetting, they do not readily soften with the application of heat. Care must be exercised when applying heat to soften adhesives so that the temperature rise does not damage the underlying laminate or neighboring components. Organic solvents such as those containing alcohols, acetone, methyl chloride, and so on (the use of some of which may be strictly controlled for environmental health and safety reasons) can successfully dissolve a number of adhesive compounds. However, it must be confirmed that these solvents do not attack the package materials of the components, the solder mask and laminate, or critical markings. Lead-free soldering raises the following two concerns regarding repair and rework procedures: higher melting temperatures of the Pb-free solders, and the mixing of Sn-Pb and Pb-free solders. Clearly, the higher melting temperatures of the Pb-free solders increase the likelihood of thermal effects that include remelting of neighboring solder joints and thermal damage to component packages and the circuit board laminate. As noted previously, this concern can be readily addressed during process development efforts, through the use of thermocouples placed on the targeted component as well as on neighboring components, solder joints, and circuit board surfaces. The second issue is that of mixing Pb-free and Sn-Pb solder. This situation would be less likely to occur with newly fabricated product, when repair and rework procedures are performed immediately after assembly inspection. The same solder would be used for both processes. Rather, the concern arises particularly with regard to the rework of legacy products that are returned from service. Older, field-return electronics were most likely assembled with a Sn-Pb solder. In those cases where Pb-free rework procedures are in full use, there is the likelihood of intermixing Sn-Pb and Pb-free solders in the interconnections. In terms of the rework process itself, the poorer solderability of Pb-free solders will be improved by Sn-Pb residues remaining on the circuit board pads. (The I/O finish of the replacement component will likely be Pb-free, unless the component was in storage as a lifeof-program-buy [LoPB] for that system. Then, the Sn-Pb finish on the I/O will also improve Pb-free solderability.) However, because there are concerns regarding the long-term reliability of mixed-solder interconnections, it may be necessary to remove more thoroughly any Sn-Pb solder residue from the circuit board pad or through hole. Care must be exercised to not overwork the Cu features, which may result in a loss of their adhesion to the laminate (e.g., pad lifting). Other degradation modes include excessive dissolution of the Cu features, particularly at the knee on the top and bottom of through-hole barrels as well as damage to the solder mask or underlying laminate material. Repair and rework procedures differ between through-hole-mount and surface-mount interconnections.That difference is due to the size and geometries of the interconnections, the number of I/Os on the packages, the thermal sensitivity of the components, and the overall density of the printed wiring assemblies. The following subsections describe these factors for the two technologies. 40.7.1 Through-Hole Technology By and large, the repair and/or rework of through-hole solder joints still uses hand-soldering procedures (see Fig. 40.30). In the case of a repair procedure, the first step is to add flux and solder to the joint. Then the soldering iron is contacted to the lead, thereby allowing the solder to reflow. The tip should be removed from the joint as soon as possible to prevent excessive heat conduction up the lead and into the component, where it may damage the active (Si chip) device(s), glass-to-metal seals, etc.
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