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It should be noted that 1. The relations are true only if the sample is immersed in a perpendicular direction at the surface of the alloy and the dimensions are constant. 2. The angle q is directly linked to surface tensions and is thus representative of the wetting quality. 3. The smaller the wetting angle q the better the solderability! A rating of solderability, quality-based on contact with the wetting angle is listed in Table 42.2.
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TABLE 42.2 A Relative Index of Solderability as a Function of Contact Wetting Angle Angle value ( ) q 30 q 40 q 55 q > 55 Quality rating Excellent Good Acceptable Rejectable
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SOLDERABILITY TESTING A SCIENTIFIC APPROACH
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Solderability defects can result from poor line management, poor chemical management, incorrect deposit thickness (whether real or incorrectly measured), poor choice of chemical supplier, poor understanding of metallurgy and solderability, and/or a combination of all of these items. Being able to measure solderability correctly and accurately is necessary for fixing these problems and for producing acceptable parts for the end user. If the test always accepts the sample, or there is little to no discrimination between inputs to the line, the supplier will never develop a robust process and then will never supply parts with zero defects accordingly. However, if the solderability test is performed correctly, data can be generated to determine whether significant relationships exist between two or more variables that have a positive or negative impact on the final product performance. These are known as analytic studies, as defined by Deming, and are used to increase the knowledge about the system of causes that affect the process. These are considered among the most important uses of measurement data because they lead ultimately to better understanding of processes. The benefit of using data-based procedures is largely determined by the quality of the measurement data used. If the data quality is low, the benefit of the procedure is likely to be low, such as from dip and look solderability testing. Similarly, if the quality of the data is high, the benefit is likely to be high also. The quality of measurement data is related to the statistical properties of multiple measurements obtained from a measurement system operating under stable conditions. For example, someone might be testing plated lead frames of varying deposit thicknesses and stressing the parts using steam exposure. If there is a reduction in solderability, as a function of thickness and time exposure, then the data produced would be considered of high quality. If there is no discrimination between any of the groups, and all pass or all fail, then the quality of the data would be considered low.
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42.3.1 Commonly Used Statistical Properties The statistical properties most commonly used to characterize the quality of the data are bias and variance. Bias refers to the location of the data relative to the true value and variance refers to the spread in the data. Variance is a major player in producing low-quality data. Over the years, the science of evaluating pieces of test equipment and their suitability to accurately measure whatever they are being used for has evolved. By having a test that is scientifically and statistically believable, the results obtained can be trusted and thus correct
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SOLDERABILITY: INCOMING INSPECTION AND WET BALANCE TECHNIQUE
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judgments can be made on their results. Using a child s toy to measure the thickness of a lead frame is obviously silly, but attempting to fix a plating line problem for solderability using tweezers and a solder pot falls into the same category just silly! 42.3.2 Gauge Repeatability and Reproducibility (GR&R) and Measurement System Analysis (MSA) Background The first evolutionary step was the use of Gauge Repeatability and Reproducibility (GR&R) testing that took into account both the suitability of the test equipment as well as the operator/technician/engineer performing the test. Detailed worksheets were created by the likes of IBM and it became commonplace to speak of a gauge with a 10 percent GR&R rating being very acceptable for its task, with minimal negative influences imparted by the person conducting the test.A gauge with values between 10 and 30 percent was said to be acceptable, and anything above 30 percent required immediate attention to determine whether it was the piece of equipment, the operator, or the interaction between the two that was producing such unacceptable results. Solderability testing by dip and look methods do not meet this minimum requirement. The science of GR&R has since evolved into Measurement System Analysis (MSA), where GR&R is only one part of a system that evaluates the total measurement capability. MSA is an experimental and mathematical method of determining how much the variation within the measurement process contributes to overall process variability. It takes into account
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Bias The difference between the observed value and reference value. Stability The total variation in the measurements obtained with a measurement system, on the same master or parts, when measuring a single characteristic over an extended time period. Repeatability The variation in measurements obtained with one measurement instrument when used several times by an appraiser; all while measuring the identical characteristic on the same part. Reproducibility The variation in the average of the measurements made by different appraisers using the same measuring instrument when measuring the identical characteristic on the same part. Linearity The difference in the bias values through the expected operating range of the gauge.
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All of these requirements can be attributed to solderability testing, even though at first glance it would appear to have nothing to do with it. Being able to test to a protocol that meets the previous requirements provides useable data for process development and improvement and hopefully will facilitate a much shorter development time than might otherwise be the case. Classic solderability testing, using dip and look techniques, cannot meet any of the previous requirements. 42.3.3 The Wetting Balance and Measurement System Analysis (MSA) For solderability testing there is only one method that has the potential to meet the requirements of MSA and that is testing by wetting balance. Not all wetting balances are, of course, created equal and the ease of use, or lack there of, can have a serious impact on the final MSA analysis and ultimate acceptance of the data. Part of the problem in previous evaluations of the wetting balance has been the samples used for testing the performance of the machine.Typically, with GR&R or MSA, samples are tested repeatedly by numerous people in a random order. When testing with a wetting balance, soldering a part is required. This means that it is a one use item that cannot be tested again. Testing components clearly is not an option, as the natural variation from a plating process (assuming it is one that is in control), may contribute enough variation to fail the evaluation. To get around this one-time test, the solution has been to place known weights that are calibrated and certified on to the wetting balance (which is measuring force as a function of displacement of a sensor) and then record the force measurement as a function of the weight applied. Calibrated weights in the range of 100 milligrams to 5 grams were used
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