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Co-solvent cleaning involves the use of a rinsing agent that is volatile and a solvating agent that is not volatile. The assembly is placed into the wash tank of boiling solvent where the solvating agent enhances the cleaning process. The vapor blanket above the wash sump contains only the rinsing agent. The assembly is moved from the wash sump into the rinse sump, which contains only the condensed rinsing agent. Finally, the assembly is removed from the rinse sump and held in the vapor blanket for a final rinse and drying step.
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Aqueous Cleaning Aqueous defluxing is performed using a high pH saponifying solution that is diluted to a 10 to 25 percent aqueous solution. The saponifier may be organic or inorganic, with additives such as solvents and surfactants to improve wetting and cleaning. The organic cleaning agent usually contains an amine, such as monoethanol amine, whereas the inorganic cleaners use buffered metal salts such as NaOH/sodium carbonate/sodium bicarbonate. The wash step is usually done in an inline spray machine, followed by a de-ionized (DI) water rinse with several spray sections to remove the more contaminated material, then by a final rinse and a final blow-dry step. The cleaning agents in the saponifier react with the rosin or resin from the flux to form a soap in the same manner that the detergent used to wash greasy dishes reacts with the grease and helps it dissolve, or at least be emulsified and removed in the rinse water. Once the rosin or resin is removed, the rinse water solubilizes the ionic residues that were on the surface of the board as well as those trapped within the solid rosin matrix. Table 43.5 summarizes the possible cleaning agents for the various flux types.
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TABLE 43.5 Soldering Flux/Paste Cleaning Options Flux/paste type 1. Rosin/resin Possible cleaning agents a. b. c. a. b. c. d. a. b. Detergent cleaning Semiaqueous cleaning Solvent cleaning No-cleaning step Aqueous cleaning Detergent Solvent Water Detergent cleaning Comments
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2. Low-residue flux
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If flux is rated L0 or L1 in ANSI-J-Std-004 If flux does not contain rosin or resin If flux contains rosin or resin
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3. Water-soluble
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Flux and Cleaning Issues Related to Lead-Free Soldering Solder flux residues are much more difficult to clean after lead-free soldering.19,20,21 Fluxes formulated to remove oxidized metals (SnPb, Cu) for traditional tin-lead soldering must be modified to address the needs of different metallization for the solder, the board finish, and component terminations. Soldering flux formulations for lead-free soldering use higher molecular weight resins and activators for the more aggressive flux chemistry needed to achieve wetting. Also, the higher tin content of the alternative solders (SnAgCu, SnCu) requires more aggressive flux chemistries for good wetting. The process window for lead-free soldering requires higher peak reflow temperatures and longer times above liquidus. Soldering in a nitrogen environment improves wetting and reduces oxidation of the flux residues and the solder. Due to the higher reflow temperature,
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greater polymerization of the flux constituents can occur producing residues that are more difficult to remove. The cleaning challenge represented by lead-free soldering must be addressed by modifying the cleaning process to increase the wash time, wash concentration, and wash temperature. Cleaning for fine-pitch components soldered under lead-free conditions requires an increase in cleaning time, the use of increased solution agitation (e.g., ultrasonic), and the modification of spray nozzles and impingement angle. Flux residues are more difficult to remove when they set. Thus, it is important to minimize the time between reflow and cleaning. Aqueous cleaning chemistries should include wetting agents, solvating agents, and reactive agents. Water-soluble fluxes that can be cleaned with water after lead-based soldering conditions may require the addition of some cleaning agent to remove the higher molecular weight organic acids and the tin salts created when the flux decomposes during lead-free reflow.
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