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53. Assembly Inspection
QR Code Recognizer In None
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QR Code Printer In None
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53.1 Introduction / 53.1 53.2 Definition of Defects, Faults, Process Indicators, and Potential Defects / 53.3 53.3 Reasons for Inspection / 53.4 53.4 Lead-Free Impact on Inspection / 53.6 53.5 Miniaturization and Higher Complexity / 53.8 53.6 Visual Inspection / 53.8 53.7 Automated Inspection / 53.12 53.8 Three-Dimensional Automated Solder Paste Inspection / 53.14 53.9 PRE-Reflow Aoi / 53.16 53.10 Post-Reflow Automated Inspection / 53.17 53.11 Implementation of Inspection Systems / 53.23 53.12 Design Implications of Inspection Systems / 53.24 References / 53.25
QR-Code Reader In None
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QR Code 2d Barcode Creation In Visual C#
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54. Design for Testing
Denso QR Bar Code Generation In VS .NET
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54.1 Introduction / 54.1 54.2 Definitions / 54.2 54.3 AD HOC Design for Testability / 54.2 54.4 Structured Design for Testability / 54.4 54.5 Standards-Based Testing / 54.5 References / 54.12
Encoding Denso QR Bar Code In Visual Basic .NET
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Code 128A Generation In None
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55. Loaded Board Testing
GTIN - 13 Generator In None
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EAN / UCC - 14 Generation In None
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55.1 Introduction / 55.1 55.2 The process of Test / 55.1 55.3 Definitions / 55.4 55.4 Testing Approaches / 55.7 55.5 In-Circuit Test Techniques / 55.11 55.6 Alternatives to Conventional Electrical Tests / 55.17 55.7 Tester Comparison / 55.19 References / 55.20
Code 39 Drawer In None
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Bar Code Creator In None
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Part 13
Encoding Monarch In None
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Generate Bar Code In None
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Reliability
Make UPC-A Supplement 5 In Java
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Data Matrix ECC200 Drawer In Visual Basic .NET
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56. Conductive Anodic Filament Formation
Paint Code 128A In .NET Framework
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GS1 - 13 Generation In Java
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56.1 Introduction / 56.3 56.2 Understanding CAF Formation / 56.3
GS1 DataBar Limited Creation In Java
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Recognizing ANSI/AIM Code 128 In .NET Framework
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CONTENTS
xvii
56.3 Electrochemical Migration and Formation of CAF / 56.7 56.4 Factors that Affect CAF Formation / 56.10 56.5 Test Method for CAF-Resistant Materials / 56.14 56.6 Manufacturing Tolerance Considerations / 56.14 References / 56.15
57. Reliability of Printed Circuit Assemblies
57.1 Fundamentals of Reliability / 57.2 57.2 Failure Mechanisms of PCBS and Their Interconnects / 57.4 57.3 Influence of Design on Reliability / 57.19 57.4 Impact of PCB Fabrication and Assembly on Reliability / 57.20 57.5 Influence of Materials Selection on Reliability / 57.27 57.6 Burn-in, Acceptance Testing, and Accelerated Reliability Testing / 57.36 57.7 Summary / 57.45 References / 57.45 Further Reading / 57.47
58. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
58.1 Introduction / 58.1 58.2 Packaging Challenges / 58.2 58.3 Variables that Impact Reliability / 58.5 References / 58.30
59. Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders
59.1 Introduction / 59.1 59.2 Thermomechanical Reliability / 59.3 59.3 Mechanical Reliability / 59.20 59.4 Finite Element Analysis (FEA) / 59.27 References / 59.35
Part 14 Environmental Issues
60. Process Waste Minimization and Treatment
60.1 Introduction / 60.3 60.2 Regulatory Compliance / 60.3 60.3 Major Sources and Amounts of Wastewater in a Printed Circuit Board Fabrication Facility / 60.5 60.4 Waste Minimization / 60.6 60.5 Pollution Prevention Techniques / 60.8 60.6 Recycling and Recovery Techniques / 60.15 60.7 Alternative Treatments / 60.18 60.8 Chemical Treatment Systems / 60.21 60.9 Advantages and Disadvantages of Various Treatment Alternatives / 60.26
xviii
CONTENTS
Part 15 Flexible Circuits
61. Flexible Circuit Applications and Materials
61.1 61.2 61.3 61.4 61.5 61.6 61.7 61.8 61.9 61.10 61.11 Introduction to Flexible Circuits / 61.3 Applications of Flexible Circuits / 61.6 High-Density Flexible Circuits / 61.6 Materials for Flexible Circuits / 61.8 Substrate Material Properties / 61.9 Conductor Materials / 61.13 Copper-Clad Laminates / 61.14 Coverlay Material / 61.19 Stiffener Materials / 61.22 Adhesive materials / 61.22 Restriction of Hazardous Substances (RoHS) Issues / 61.23
62. Design of Flexible Circuits
62.1 62.2 62.3 62.4 62.5 62.6 62.7 Introduction / 62.1 Design Procedure / 62.1 Types of Flexible Circuits / 62.2 Circuit Designs for Flexibility / 62.12 Electrical Design of the Circuits / 62.15 Circuit Designs for Higher Reliability / 62.16 Circuit Designs for RoHS Compliance / 62.17
63. Manufacturing of Flexible Circuits
63.1 63.2 63.3 63.4 63.5 63.6 63.7 63.8 63.9 63.10 63.11 Introduction / 63.1 Special Issues with HDI Flexible Circuits / 63.1 Basic Process Elements / 63.3 New Processes for Fine Traces / 63.14 Coverlay Processes / 63.24 Surface Treatment / 63.30 Blanking / 63.31 Stiffener Processes / 63.33 Packaging / 63.33 Roll-to-Roll Manufacturing / 63.34 Dimension Control / 63.36
64. Termination of Flexible Circuits
64.1 64.2 64.3 64.4 64.5 64.6 Introduction / 64.1 Selection of Termination Technologies / 64.1 Permanent Connections / 64.4 Semipermanent Connections / 64.11 Nonpermanent Connections / 64.13 High-Density Flexible Circuit Termination / 64.20
65. Multilayer Flex and Rigid/Flex
65.1 Introduction / 65.1 65.2 Multilayer Rigid/flex / 65.1
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