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Note: a Does not violate minimum electrical clearance.
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52.4.2.5 J-Leaded Components. Side overhang is acceptable up to one-half (one-quarter for Class 3) of the width of the component lead. Lead toe overhang is not specified for any class. The end lead solder-joint width is acceptable with a minimum solder-joint length of one-half (three-quarters for Class 3) of the component lead width. A side solder-joint length must be a minimum of 11/2 times the lead width for both Class 2 and 3, but Class 1 requires only a visible fillet.The maximum solder fillet height is not specified; however, the solder fillet may not touch the component package body.The minimum heel solder fillet height must cover one-half of the thickness of the component lead or the lead thickness for Class 3 (see Table 52.5).
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TABLE 52.4 Dimensional Criteria: Flat Ribbon, L, and Gull-Wing Leads Feature Maximum Side Overhang Maximum Toe Overhang Minimum End Joint Width Minimum Side Joint Lengthb When (L) Is 3 W When (L) Is <3 W E F G L T W Dim. A B C D Class 1 Class 2 Class 3 25% (W) or 0.5 mm (0.02 in.), whichever is lessa 75% (W)
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50% (W) or 0.5 mm (0.02 in.), whichever is lessa Does not violate minimum electrical clearance 50% (W) (1W) or 0.5 mm [0.02 in.], whichever is less
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3 (W) or 75% L, whichever is longer 100% (L)
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Maximum Heel Fillet Height Minimum Heel Fillet Height Solder Thickness Formed Foot Length Lead Thickness Lead Width
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Wetting is evident
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See Section 52.4.2.1 (G) + 50% (T)c (G) + (T)c Wetting is evident Unspecified dimension, determined by design Unspecified dimension, determined by design Unspecified dimension, determined by design
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Notes: a Does not violate minimum electrical clearance. b Fine-pitch leads require a minimum side fillet length of 0.5 mm (0.02 in.). c In the case of a toe-down lead configuration, the minimum heel fillet height (F) extends at least to the midpoint of the outside lead bend.
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TABLE 52.5 Dimensional Criteria: J Leads Feature Maximum Side Overhang Maximum Toe Overhang Minimum End Joint Width Minimum Side Joint Length Maximum Fillet Height Minimum Heel Fillet Height Solder Thickness Lead Thickness Lead Width Dim. A B C D E F G T W Class I
Class 2
Class 3
50% (W) 25% (W)a Unspecified dimension, determined by designa 50% (W) 75% (W) Wetting is 150% (W) evident Solder does not touch package body (G) + 50% (T) (G) + (T) Wetting is evident Unspecified dimension, determined by design Unspecified dimension, determined by design
Note: a Does not violate minimum electrical clearance.
52.4.2.6 Ball Grid Array (BGA) Components. BGA package components are a very popular design due to significant packaging density. This allows designers to get more function in a smaller space. The component package is virtually impossible to inspect visually as traditionally allowed with other components since the solder spheres are located beneath the component. If cost justification exists, either due to volume or reliability provisions such as could be the case on Class 3 equipment, x-ray equipment can be used to verify the position quality and integrity of the solder joints. This could be costly in terms of the upfront capital investment of the x-ray equipment, but may pay for itself many times over in customer satisfaction or the prevention of defective product. Other options may use the x-ray as a process development tool where once the process is stabilized, the inspection is reduced to sampling or eliminated completely.
ACCEPTABILITY OF PRINTED CIRCUIT BOARD ASSEMBLIES
X-ray inspection can provide a visual depiction of the solder connection that must not contain solder bridges, incomplete reflow, attachment fractures, misalignment that violates minimum electrical clearance, or missing or damaged spheres. It s also considered defective for solder voids to displace more than 25 percent of a sphere (see Fig. 52.19).
FIGURE 52.19 Ball grid array (BGA), bottom view showing solder ball connection. (IPC)
52.4.3 Use of Adhesives Adhesives can often be used in SMT and PTH applications. For SMT components, adhesive may be used to attach components to the bottom side of the PCB for mixed technologies (those containing both through-hole and SMT components). In some process flows, the SMT components are placed with adhesive between the solder pads; the PCB is processed through an adhesive curing cycle; then the components are wave soldered or reflowed onto the PCB along with the PTH components. In some processes, the adhesive is a temporary (soluble) attachment to stabilize the components during soldering and is to be removed after the solder is attached. In some extreme cases, the adhesive is used for both through-hole and SMT components to support the physical attachment of the components for severe operational conditions such as physical shock or vibration. Where intended to support the component physically, the attachment is specifically defined by drawing or individual requirements. The SMT components are acceptable as long as the adhesive has not contaminated the solder joint. If adhesive has contaminated the component solderable surface, lead, end cap, or PCB pad such that an acceptable solder joint is not achieved, the PCBA is not acceptable (see Fig. 52.20). Normally in PTH component applications, adhesive is used to give large-profile and/or heavy components more mechanical stability. When adhesives are used in this manner, the following adhesive acceptance criteria apply:
The adhesive must adhere to a flush-mounted axial component for 50 percent of the component length and 25 percent of its diameter on one side. The build-up of adhesive should
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