barcode reading in c#.net COMPONENT-TO-PWB RELIABILITY in Software

Create QR Code ISO/IEC18004 in Software COMPONENT-TO-PWB RELIABILITY

COMPONENT-TO-PWB RELIABILITY
Read Denso QR Bar Code In None
Using Barcode Control SDK for Software Control to generate, create, read, scan barcode image in Software applications.
QR-Code Encoder In None
Using Barcode maker for Software Control to generate, create Denso QR Bar Code image in Software applications.
17. Michael L. Eyman, Gary B. Kromann, Investigation of Heat Sink Attach Methodologies and the Effects on Package Structural Integrity and Interconnect Reliability of the 119-Lead Plastic Ball Grid Array, Electronic Components and Technology Conference, 1997, pp. 1068 1075. 18. Deepak Goyal,Tim Lane, Patrick Kinzie, Chris Panichas, Kam Meng Chong, Oscar Villalobos, Failure Mechanisms of Brittle Solder Joint Fracture in the Presence of Electroless Nickel Immersion Gold (ENIG) Interface, Electronic Components and Technology Conference, 2004, pp. 732 739. 19. Kozo Harada, Shinji Baba, Qiang Wu, Hironori Matsushima, Toshihiro Matsunaga, Yasumi Uegai, Michitaka Kimura, Analysis of Solder Joint Fracture under Mechanical Bending Test, Electronic Components and Technology Conference, 2003 pp. 1731 1737. 20. Shelgon Yee, Lodgers Chen, Justin Zeng, Roger Jay, Ternary Intermetallic Compound - A Real Threat To BGA Solder Joint Reliability, Journal of SMT, 2004, Vol. 17, Issue 2, pp. 29 36. 21. Chong Kam Meng, Tamil Selvy Selvamuniandy, and Charan Gurumurthy, Discoloration related failure mechanism and its root cause in Electroless Nickel Immersion Gold (ENIG) Pad metallurgical surface finish, Proceedings of 11th IPFA, Taiwan, 2004, pp. 229 233. 22. Tz-Cheng Chiu, Kejun Zeng, Roger Stierman, Darvin Edwards, Kazuaki Ano, Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages , Electronic Components and Technology Conference, 2004 pp. 1256 1262. 23. Kejun Zeng, Roger Stierman, Tz-Cheng Chiu, Darvin Edwards, Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability, Journal of Applied Physics, 2005, 97, 024508. 24. Zequn Mei, Mudasir Ahmad, Mason Hu, Gnyaneshwar Ramakrishna, Kirkendall Voids at Cu/Solder Interface and Their Effects on Solder Joint Reliability, Electronic Components and Technology Conference, 2005, pp. 415 420. 25. IPC/JEDEC-9704, Printed Wiring Board Strain Gage Test Guideline, June 2005. www.jedec.org. 26. J. H. Lau (ed.), Ball Grid Array Technology, McGraw-Hill, New York, 1995. 27. Commission Decision of 21 October 2005, Amending for the Purposes of Adapting to Technical Progress the Annex to Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (Notified Under Document Number C(2005) 4054) 2005/747/EC, Official Journal of the European Union, EN, 25.10.2005, L280/18 19. http://eur-lex.europa.eu/LexUriServ/site/en/oj/2005/l_280/l_ 28020051025en00180019.pdf. 28. Yuan Li, Anil Pannikkat, Larry Anderson, Tarun Verma, Bruce Euzent, Building Reliability into Full-Array BGAs, 26th IEMT Symposium PackCon, 2000, pp. A-1-A-7. 29. R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein (eds.), Microelectronics Packaging Handbook, Chapman & Hall, New York, 1997. 30. J. H. Lau (ed.), Thermal Stress and Strain in Microelectronics Packaging,Van Nostrand Reinhold, New York, 1993. 31. J. M. Gere and S. P. Timoshenko, Mechanics of Materials, 2d ed., PWS Publishers, California, 1984. 32. Gary S. May, Simon M. Sze, Fundamentals of Semiconductor Fabrication, John Wiley & Sons (Asia) Pte Ltd., 2004, pp. 162 163. 33. T. Homma, Low Dielectric Constant Materials and Methods for Interlayer Dielectric Films in Ultralarge-Scale Integrated Circuit Multilevel Interconnects Mater. Sci. Eng., 1998, 23, 243. 34. M. Jimarez, et al, Technical Evaluation of a Near Chip Scale Size Flip Chip/Plastic Ball Grid Array Package, Electronic Components and Technology Conference, 1998, pp. 219 225. 35. K. Chen, et al, Effects of underfill materials on the reliability of low-k flip-chip packaging, Microelectronics Reliability, 2006, Vol. 46, No. 1, pp. 155 163. 36. Pei-Haw Tsao, et al, Underfill Characterization for low-k Dielectric/Cu Interconnect IC, Electronic Components and Technology Conf, 2004, pp. 767 769. 37. E. Hayashi, S. Baba, S. Idaka, A. Maeda, M. Satoh, M. Kimura, Realization of Pb-free FC-BGA Technology on Low-k Device, Electronic Components and Technology Conference, 2005, pp. 9 13. 38. F. Keller, J. W. Brunner, T. Pan, Optimization of Wire Bonding over Cu-Low K Pad Stack, 36th International Symposium on Microelectronics, IMAPS, 2003.
QR Code Reader In None
Using Barcode decoder for Software Control to read, scan read, scan image in Software applications.
QR Code 2d Barcode Creation In Visual C#.NET
Using Barcode creation for .NET Control to generate, create QR Code JIS X 0510 image in VS .NET applications.
Denso QR Bar Code Maker In .NET
Using Barcode creation for ASP.NET Control to generate, create QR Code JIS X 0510 image in ASP.NET applications.
Quick Response Code Maker In .NET Framework
Using Barcode generator for VS .NET Control to generate, create QR Code image in VS .NET applications.
QR Code Generation In Visual Basic .NET
Using Barcode printer for .NET Control to generate, create QR Code image in VS .NET applications.
Painting Barcode In None
Using Barcode creation for Software Control to generate, create bar code image in Software applications.
Paint UPC-A In None
Using Barcode printer for Software Control to generate, create Universal Product Code version A image in Software applications.
Code 39 Creator In None
Using Barcode maker for Software Control to generate, create Code 3/9 image in Software applications.
Encode Code 128 Code Set A In None
Using Barcode generation for Software Control to generate, create Code128 image in Software applications.
Generating Data Matrix In None
Using Barcode generator for Software Control to generate, create ECC200 image in Software applications.
Identcode Encoder In None
Using Barcode drawer for Software Control to generate, create Identcode image in Software applications.
Bar Code Maker In Java
Using Barcode creation for Java Control to generate, create bar code image in Java applications.
Bar Code Creator In Java
Using Barcode drawer for BIRT reports Control to generate, create bar code image in BIRT reports applications.
Bar Code Generator In Visual Basic .NET
Using Barcode printer for VS .NET Control to generate, create bar code image in .NET applications.
Encode GS1-128 In Visual C#
Using Barcode encoder for .NET Control to generate, create GS1-128 image in .NET framework applications.
Code 39 Printer In Objective-C
Using Barcode generation for iPad Control to generate, create ANSI/AIM Code 39 image in iPad applications.
Print Barcode In Java
Using Barcode generator for Android Control to generate, create bar code image in Android applications.
Scanning Code-39 In Java
Using Barcode recognizer for Java Control to read, scan read, scan image in Java applications.
Copyright © OnBarcode.com . All rights reserved.