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TABLE 61.15 Basic Properties of Screen-Printable Coverlay Manufacturer Grade Base resin Color Hardness Peel strength Flexibility Soldering resistance Insulation resistance ( ) Flammability Taiyo Ink S-222 Epoxy Green 5H 100/100 (crosshatch) N/A 260 C 20 sec. >1 exp 13 UL-94-V-0 Nippon Polytech NPR-5 Epoxy Green H 100/100 (crosshatch) 0.5 mm diameter 260 C 20 sec. >1 exp 12 UL-94-V-0
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Generally, because of poor resolution, a screen-printing process does not satisfy the requirements of high-density SMT assembling on flexible circuits. Also, such as process does not provide good mechanical performance for dynamic flexing.Typical property examples are shown in Table 61.15.
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Dry-Film Type Photoimageable Coverlay The basic idea of the photoimageable coverlay is to satisfy both of fine resolutions of the opening and physical flexibility by one single material. Also, its simple manufacturing process should reduce costs. From a processing standpoint, there are two types of PIC materials: dry film and liquid. The dry-film type is easily processed when manufactured with vacuum laminators, which provide good encapsulation with the fine conductors. A vacuum press is also available for a small-volume production. However, the cost per unit area is higher for the dry-film type than for liquid materials. Dry-film type and liquid ink type photoimageable coverlay materials have been developed with different resin matrixes to satisfy different technical requirements of HDI flexible circuits. A comparison of the materials is given in Table 61.16. Properties of the materials are shown in Tables 61.17 and 61.18.
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TABLE 61.16 Comparison of Photoimageable Coverlay Materials Dry film type Acrylic-base/epoxy-base Applicator Vacuum laminator Polyimide-base Roll laminator Liquid ink type Epoxy-base Screen print Spray coat Curtain coat 10 25 70 * Acceptable * Good Fair High Refrigerator Slow Low Low Polyimide-base Screen print Spray coat Roll coat 10 20 50 Good Good * Excellent Difficult Very high Freezer Slow High Low
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Thickness range (mm) Minimum opening (mm) Flexibility Heat resistance Electrical properties Chemical properties Handling Technical hardle Storage condition Quick turn Material cost Process cost
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25 50 70 * Acceptable * Acceptable Easy Low Refrigerator Easy Medium Medium
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25 50 70 Good Excellent Good Good Difficult High Room temperature Easy High High
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Depends on manufacturer.
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FLEXIBLE CIRCUIT APPLICATIONS AND MATERIALS
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TABLE 61.17 Properties of Liquid/Epoxy-Type Photoimageable Coverlay Manufacturer Grade Pencil hardness Bond strength on copper Flexibility Insulation resistance ( ) Volume resistance ( cm) Dielectric strength Soldering resistance Flammability Resistance in Ni/Au plating Exposure intensity (mJ/cm2) Developer PolyTech NPR-80 5H 100/100 MIT test 0.5 mm R >500 times 2 exp 12 (IPC) 28 kV/mm 260 C 10 s UL-94-V-0 Pass 150 Sodium carbonate Coates Image Flex H, HB 100/100 1-mm mandrel: pass 5 exp 11 (IPC) 91 kV/mm 260 C 10 s UL-94-VTM-0 Pass 400 Sodium carbonate Asahi Focus Coat 4H 100/100 180 bend:pass 6 exp 13 (JIS) 5 exp 14 (2.1 kV/0.16 mm) 260 C 1 min N/A Pass 300 Sodium carbonate Peters Elpemer 6H 100/100 3-mm mandrel: pass 2 exp 14 (VDE) 1 exp 15 88 kV/mm 288 C 20 s UL-94-V-0 Pass 150 Sodium carbonate
61.8.3.1 Acrylic or Epoxy/Dry-Film Type. Acrylic or epoxy/dry-film types were the first materials developed to act as the flexible photoimageable coverlay for HDI flexible circuits. They have the same product concept as the photoimageable solder mask of rigid circuit boards. The same vacuum laminators and imaging equipment are available for these materials. Managing the conditioning of the process is not difficult. Acrylic or epoxy/dry-film types are good for small-volume production because of the flexible manufacturing process. They may need some more improvements in electrical performance and chemical resistance if they are to be used in the general application of high-density flexible circuits. The present version
TABLE 61.18 Properties of Different Photoimageable Coverlay Materials DuPont Material Pencil hardness Tensile strength (MPa) Elongation CTE (ppm/K) Bond strength on copper Flexibility Surface resistance ( ) Volume resistance ( *cm) Dielectric strength (kV/mm) Dielectric constant Loss tangent Soldering resistance Flammability Resistance in Ni/Au plating Exposure intensity (mJ/cm2) Developer Puralux PC Acrylic/dry film 3H N/A >55% 130 100/100 MIT 0.38R 100 times >1.0 exp 12 3.4 exp 16 >80 3.5 3.6 0.03 260 C 10 s UL-94 Pass 200 Sodium carbonate NSCC Espanex SFP Polyimide/dry film 226 23 0.8 kg/cm MIT 0.38R 1200 times >1.0 exp 13 1.0 exp 16 3.5 0.007 350 C (JIS) UL-94-VTM-0 Pass 400 Lactic acid solution Nitto Denko JR-3000 Polyimide/liquid ink 120 11% 35 100/100 N/A 5 exp 15 240 3.3 0.6 >300 C Self-distinguishable Pass 500 Alkaline solution Toray Photoneece Polyimide/liquid ink 148 36% 16.1 100/100 N/A >1.0 exp 16 >1.0 exp 16 >300 3.2 0.002 >300 C Self-distinguishable Pass 150 Special chemical
The materials were developed assuming different applications; therefore measured data are not exactly equivalent.
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