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PACKAGING
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Many ideas have been introduced for packaging fragile HDI flex circuits. The packaging should provide easy handling capability, including the processing of the assembling side. A reeled tape modified from TAB technology is a valuable solution for volume production. A sheet carrier is another possible solution for medium- and large-scale production. Reusable cartridge or container designed for each circuit is recommended for volume production. An appropriate packaging design results a lot of benefit for both flex circuit manufacturers and customers. It needs a total design of the circuits including their manufacturing and assembling to optimize the productivities.
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Roll-to-roll (RTR) manufacturing is a specialty developed for rolled materials of flex circuits. It can reduce manual handling and defects caused by human errors; therefore, when running effectively, it will increase productivity significantly and reduce manufacturing cost. On the other hand, RTR manufacturing has several serious disadvantages and a lot of applied limitations. It requires a large investment and advanced engineering capabilities. It is not appropriate for small-volume production, and can create a lot of scrap when not set up correctly. Table 63.10 shows advantages and disadvantages of RTR manufacturing systems for flex circuits. Table 63.11 shows available manufacturing processes and typical examples. Most RTR systems are developed for single-sided flex circuits.
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TABLE 63.10 Advantages and Disadvantages of RTR Systems Advantages
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Disadvantages
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High productivity High process yields Low manufacturing cost
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Small flexibility for small volume Much scrap caused by small mistakes Large investment cost Limited for quick turnaround Low flexibility for design changes
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TABLE 63.11 Availability of RTR Processes Process Surface cleaning Via hole generation Via hole plating Resist coating Pattern generation Developing Etching/strip resist Coverlay Surface treatments Blanking Inspection Stiffener boards Technical difficulty Standard machines available Possible, but difficult Big investment Standard machines available Standard machines available Standard machines available Standard machines available Possible, but difficult Standard machines available Possible, but difficult Possible, but difficult Difficult
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RTR Drilling There have been significant technical barriers to applying the RTR system for double-sided flex circuit with through-holes. The NC drilling process is the bottleneck in introduction of the RTR system. A punching process, which is basically a continuous-flow process element, is an alternative technology to NC drilling of the RTR system to be used for double-sided flex circuits. However, it requires an expensive punching die and is not flexible for a design change. An RTR base NC drilling machine has been developed, as shown Fig. 63.34. The machine is capable to generate smaller holes than 100 micron diameters processing multiple rolls in a same time.
MANUFACTURING OF FLEXIBLE CIRCUITS
S1 S2 Loader
Work Work Work
Un-loader
Entry Work Work Work Work
Work
Entry
Work
Work
Work
Backup
Backup
Work
Work
Work
FIGURE 63.34 Reel-to-reel base numerical control drilling machine. (Source: Hitachi Via Mechanics.)
The new via hole technologies such as laser drilling and chemical etching are an innovative solution for generating small holes in rolled materials. A blind-via hole design is preferred for these RTR manufacturing processes.
RTR Copper Plating Technically, RTR copper plating is possible. But the line will be very long, and it is not easy to have uniform quality for the wide rolls.There is a difficult choice which is better vertical system or horizontal process.
Pattern Generation The pattern generation processes of resist coating, photo-print, development, etching and resist stripping are well established for single-side circuits. There are several key points such as straightness of the whole line, EPC (Edge Position Control), etc. Stability of loader/un-loader could be an example. Appropriate stabilities are required for the one-side holding systems of the rolled materials, especially for the wide materials. There are not many technical difficulties with double-side circuits for we processes such as development or etching. On the other hand, special alignment systems are required between top/bottom and holes/traces.
RTR Coverlay Process After etching process, technical hurdles to apply RTR become extremely higher compared to previous processes because of the difficult alignments between the patterns. The coverlay process could be the typical example. RTR lamination of film coverlay is almost impossible. The screen-printing for RTR processing has developed for relatively rough circuit patterns. The photo-imageable coverlay system could be the right solution for the RTR process of the coverlay of the flexible circuits. However, there have been several limitations to apply.
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