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COPOLYMER: See polymer. CORE MATERIAL: The fully
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cured inner-layer segments, with circuiting on one or both sides, that form the multilayer circuit. CORNER MARKS: The marks at the corners of printed board artwork, the inside edges of which usually locate the borders and establish the contour of the board. COUPON: One of the patterns of the quality conformance test circuitry area. (See test coupon.) CRAZING: A base material condition in which connected white spots or crosses appear on or below the surface of the base material. They are due to the separation of fibers in the glass cloth and connecting weave intersections. CROSS-LINKING: The forming of chemical links between reactive atoms in the molecular chain of a plastic. It is cross-linking in the thermosetting resins that makes the resins infusible. CROSS TALK: Undesirable electrical interference caused by the coupling of energy between signal paths. CRYSTALLINE MELTING POINT: The temperature at which the crystalline structure in a material is broken down. CTE: Coefficient of thermal expansion. The measure of the amount a material changes in any axis per degree of temperature change. CURE: To change the physical properties of a material (usually from a liquid to a solid) by chemical reaction or by the action of heat and catalysts, alone or in combination, with or without pressure. CURING AGENT: See hardener. CURING TEMPERATURE: The temperature at which a material is subjected to curing. CURING TIME: In the molding of thermosetting plastics, the time in which the material is properly cured. CURRENT-CARRYING CAPACITY: Maximum current which can be carried continuously without causing objectionable degradation of electrical or mechanical properties of the printed board. DATUM REFERENCE: A defined point, line, or plane used to locate the pattern or layer of a printed board for manufacturing and/or inspection purposes. DEBRIS: A mechanically bonded deposit of copper to substrate hole surfaces. DEBRIS PACK: Debris deposited in cavities or voids in the resin. DEFINITION: The fidelity of reproduction of the printed board conductive pattern relative to the production master. DELAMINATION: A separation between any of the layers of the base laminate or between the laminate and the metal cladding originating from or extending to the edges of a hole or edge of the board. DIELECTRIC CONSTANT: The property of a dielectric which determines the electrostatic energy stored per unit volume for a unit potential gradient. DIELECTRIC LOSS: Electric energy transformed into heat in a dielectric subjected to a changing electric field. DIELECTRIC LOSS ANGLE: The difference between 90 and the dielectric phase angle. Also called the dielectric phase difference. DIELECTRIC LOSS FACTOR: The product of dielectric constant and the tangent of dielectric loss angle for a material. DIELECTRIC PHASE ANGLE: The angular difference in phase between the sinusoidal alternating potential difference applied to a dielectric and the component of the resulting alternating current having the same period as the potential difference. DIELECTRIC POWER FACTOR: The cosine of the dielectric phase angle (or sine of the dielectric loss angle). DIELECTRIC STRENGTH: The voltage that an insulating material can withstand before breakdown occurs, usually expressed as a voltage gradient (such as volts per mil). DIMENSIONAL STABILITY: Freedom from distortion by such factors as temperature changes, humidity changes, age, handling, and stress. DIRECT IMAGING: The exposure of photo resist material with a laser without the use of positive or negative photo tool.
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tangent of the loss angle of the insulating material. Also called loss tangent or approximate power factor. DRILL FACET: The surface formed by the primary and secondary relief angles of a drill tip. DRILL WANDER: The sum of accuracy and precision deviations from the targeted location of the hole. DUMMY: A cathode with a large area used in a low-current-density pulsating operation for the removal of metallic impurities from solution. The process is called dummying. DWELL POINT: The bottom of the drilling stroke before the drill bit ascends. EDGE-BOARD CONTACTS:A series of contacts printed on or near an edge of a printed board and intended for mating with a one-part edge connector. EDX: Energy dispersive x-ray fluorescent spectrometer ELASTOMER: A material which at room temperature stretches under low stress to at least twice its length but snaps back to its original length upon release of the stress. Rubber is a natural elastomer. ELECTRIC STRENGTH: The maximum potential gradient that a material can withstand without rupture. It is a function of the thickness of the material and the method and conditions of test. Also called dielectric strength or disruptive gradient. ELECTROLESS PLATING: The controlled autocatalytic reduction of a metal ion on certain catalytic surfaces. EMULSION SIDE: The side of the film or glass on which the photographic image is present. ENTRY MATERIAL: A material placed on top of a laminate stack. EPOXY SMEAR: Epoxy resin which has been deposited on edges of copper in holes during drilling either as a uniform coating or as scattered patches. It is undesirable because it can electrically isolate the conductive layers from the plated-through-hole interconnections. ETCHBACK: The controlled removal of all the components of the base material by a chemical process acting on the sidewalls of plated-through holes to expose additional internal conductor areas. ETCH FACTOR: The ratio of the depth of etch to lateral etch. EXOTHERM: A characteristic curve which shows heat of reaction of a resin during cure (temperature) versus time. The peak exotherm is the maximum temperature on the curve. EXOTHERMIC REACTION: A chemical reaction in which heat is given off. FIBER EXPOSURE: A condition in which glass cloth fibers are exposed on machined or abraded areas. FILLER: A material, usually inert, added to a plastic to reduce cost or modify physical properties. FILM ADHESIVE: A thin layer of dried adhesive. Also, a class of adhesives provided in dry-film form with or without reinforcing fabric and cured by heat and pressure. FLEXURAL MODULUS: The ratio, within the elastic limit, of stress to corresponding strain. It is calculated by drawing a tangent to the steepest initial straight-line portion of the load deformation curve and using the equation EB = L3m/4bd3, where EB is the modulus, L is the span (in inches), m is the slope of the tangent, b is the width of beam tested, and d is the depth of the beam. FLEXURAL STRENGTH: The strength of a material subjected to bending. It is expressed as the tensile stress of the outermost fibers of a bent test sample at the instant of failure. FLUOROCARBON: An organic compound having fluorine atoms in its chemical structure, an inclusion that usually lends stability to plastics. Teflon* is a fluorocarbon. GEL: The soft, rubbery mass that is formed as a thermosetting resin goes from a fluid to an infusible solid. It is an intermediate state in a curing reaction, and a stage in which the resin is mechanically very weak. GEL POINT: The point at which gelation begins. GLASS TRANSITION POINT: The temperature at which a material loses properties and becomes a semiliquid. GLASS TRANSITION TEMPERATURE: The temperature at which epoxy, for example, softens and begins to expand independently of the glass fabric expansion rate, usually symbolized as Tg .
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