barcode reading using c#.net *Trademark of E. I. du Pont de Nemours & Company. in Software

Print QR in Software *Trademark of E. I. du Pont de Nemours & Company.

*Trademark of E. I. du Pont de Nemours & Company.
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GLOSSARY
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GLUE-LINE THICKNESS: Thickness of the fully dried adhesive layer. GRID: An orthogonal network of two sets of parallel lines for positioning features on a printed
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conducting surface used as a common reference point for circuit returns, shielding, or heat sinking. GULL WING LEAD: A surface mounted device lead which flares outward from the device body. HALOING: A light area around holes or other machined areas on or below the surface of the base laminate. HARDENER: A chemical added to a thermosetting resin for the purpose of causing curing or hardening. A hardener, such as an amine or acid anhydride for an epoxy resin, is a part of the chemical reaction and a part of the chemical composition of the cured resin. The terms hardener and curing agent are used interchangeably. HEAT-DISTORTION POINT: The temperature at which a standard test bar (ASTM D 648) deflects 0.010 in under a stated load of either 66 or 264 psi. HIGH-DENSITY INTERCONNECT (HDI): Ultra fine-geometry multilayer PWB constructed with conductive surface microvia connections between layers. (Microvia is usually defined as a hole with a diameter less than 0.006 in.) These boards also usually include buried and/or blind vias and are made by sequential build-up lamination. HOLE PULL STRENGTH:The force, in pounds, necessary to rupture a plated-through hole or its surface terminal pads when loaded or pulled in the direction of the axis of the hole. The pull is usually applied to a wire soldered in the hole, and the rate of pull is given in inches per minute. HOOK: A geometric drill bit defect of the cutting edges. HOT-MELT ADHESIVE: A thermoplastic adhesive compound, usually solid at room temperature, which is heated to fluid state for application. HYDROCARBON: An organic compound containing only carbon and hydrogen atoms in its chemical structure. HYDROLYSIS: The chemical decomposition of a substance involving the addition of water. HYGROSCOPIC: Tending to absorb moisture. I-LEAD: A surface mounted device lead which is formed such that the end of the lead contacts the board land pattern at a 90 angle. Also called a butt joint. IMPREGNATE: To force resin into every interstice of a part, as of a cloth for laminating. INHIBITOR: A chemical that is added to a resin to slow down the curing reaction and is normally added to prolong the storage life of a thermosetting resin. INORGANIC CHEMICALS: Chemicals whose molecular structures are based on other than carbon atoms. INSULATION RESISTANCE: The electrical resistance of the insulating material between any pair of contacts, conductors, or grounding devices in various combinations. INTERNAL LAYER: A conductive pattern contained entirely within a multilayer board. IPC: Institute for Interconnecting and Packaging Electronic Circuits. A leading printed wiring industry association that develops and distributes standards as well as other information of value to printed wiring designers, users, suppliers, and fabricators. IR: Infrared heating for solder-reflow operation. J-LEAD: A surface mounted device lead which is formed into a J pattern folding under the device body. JUMPER: An electrical connection between two points on a printed board added after the printed wiring is fabricated. KIRKENDALL VOIDS: In Cu-Au or Cu-Au-Sn systems, pores in the older joint, or at copper interfaces occur through solid-state diffusion. Copper which has a relatively high solubility and solid-state mobility in gold diffuses into the gold. Transported by grain boundry diffusion at temperatures below 150 C, and by bulk diffusion above that temperature. Au-Sn regions result along with atomic vacancies. Then lattice vacancies are in profusion . vpods can be observed and this material depletion weakens the solder joint. LAMINATE: The plastic material, usually reinforced by glass or paper, that supports the copper cladding from which circuit traces are created.
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