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flat heated surface of the lamination press used to transmit heat and pressure to lamination fixtures and into the lay-up. PRESSURE FOOT: The tube like device on the drilling machine that descends to the top surface of the stack, holding it firmly down, before the drill descends through the center of the pressure foot. The vacuum system of the drilling machine separates through the pressure foot to remove chips and dust formed in drilling. PRINTED WIRING ASSEMBLY DRAWING: A document that shows the printed wiring base, the separately manufactured components which are to be added to the base, and any other information necessary to describe the joining of the parts to perform a specific function. PRINTED WIRING LAYOUT: A sketch that depicts the printed wiring substrate, the physical size and location of electronic and mechanical components, and the routing of conductors that interconnect the electronic parts in sufficient detail to allow for the preparation of documentation and artwork. PRODUCTION MASTER: A 1:1 scale pattern used to produce one or more printed wiring or printed circuit products within the accuracy specified on the master drawing. PROMOTER:A chemical, itself a feeble catalyst, that greatly increases the activity of a given catalyst. PTH: Plated-through holes. Also refers to the technology that uses the plated-through hole as its foundation. QUADPACK: Generic term for surface mount technology packages with leads on all four sides. Commonly used to describe chip carrier-like devices with gull wing leads. QUALITY CONFORMANCE CIRCUITRY AREA: A test board made as an integral part of the multilayer printed board panel on which electrical and environmental tests may be made for evaluation without destroying the basic board. RAW MATERIAL PANEL SIZE: A standard panel size related to machine capacities, raw material sheet sizes, final product size, and other factors. REGISTER MARK: A mark used to establish the relative position of one or more printed wiring patterns, or portions thereof, with respect to desired locations on the opposite side of the board. REGISTRATION: The relative position of one or more printed wiring patterns, or portions thereof, with respect to desired locations on a printed wiring base or to another pattern on the opposite side of the base. REPAIR: The correction of a printed wiring defect after the completion of board fabrication to render the board as functionally good as a perfect board. RESIN: High-molecular-weight organic material with no sharp melting point. For current purposes, the term resin, polymer, and plastic can be used interchangeably. RESIST: A protective coating (ink, paint, metallic plating, etc.) used to shield desired portions of the printed conductive pattern from the action of etchant, solder, or plating. RESISTIVITY: The ability of a material to resist passage of electric current through its bulk or on a surface. RIFLING: Spiral groove or ridge in the substrate due to drilling. RIGID/FLEX:A PWB construction combining flexible circuits and rigid multilayer PWBs, usually either to provide a built-in connection or to make a three-dimensional form that includes components. ROCKWELL HARDNESS NUMBER: A number derived from the net increase in depth of an impression as the load on a perpetrator is increased from a fixed minimum load to as higher load and then returned to minimum load. ROHS: Acronym for Restriction of Hazardous Substances, The name given to a Directive of the European Union meant to reduce certain materials considered detrimental to the Environment. ROUGHNESS: Irregular, coarse, uneven hole wall on copper or substrate due to drilling. SCHEMATIC DIAGRAM: A drawing which shows, by means of graphic symbols, the electrical interconnections and functions of a specific circuit arrangement. SEM: Scanning electron microscope.
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process for making multilayer PWBs in which already finished multilayers are laminated together to form a higher-layer-count final board, or in which additional outerlayers are added to finished multilayer PWBs. SHADOWING: Etchback to maximum limit without removal of dielectric material from conductors. SINGLE-IN-LINE PACKAGE (SIP): Component package system with one line of connectors, usually spaced 0.100 in apart. SMC: Surface mounted component. Component with terminations designed for mounting flush to printed wiring board. SMD: Surface mounted device. Any component or hardware element designed to be mounted to a printed wiring board without penetrating the board. SMEAR: Fused deposit left on copper or substrate from excessive drilling heat. SMOBC: Solder mask over bare copper. A method of fabricating a printed wiring board which results in the final metallization being copper with no other protective metal; but the nonsoldered areas are coated by a solder resist, exposing only the component terminal areas. This eliminates tin-lead under the solder mask. SMT: Surface mount technology. Defines the entire body of processes and components which create printed wiring assemblies without components with leads that pierce the board. SnAu-Cu: An alloy used as a replacement for eutectic tin-lead (Sn-Pb) in lead-free solders (often referred to, and pronounced as snack ) SOI: SOIC package with J-leads rather than gull wing leads. SOIC: Small-outline integrated circuit.A plastic package resembling a small dual-in-line package (DIP) with gull wing leads on two sides for surface mounting. SOT: Small outline transistor. A package for surface-mounting transistors. SPINDLE RUNOUT:The measure of the wobble present as the drilling machine spindle rotates 360 . STORAGE LIFE: The period of time during which a liquid resin or adhesive can be stored and remain suitable for use. Also called shelf life. STRAIN: The deformation resulting from a stress. It is measured by the ratio of the change to the total value of the dimension in which the change occurred. STRESS: The force producing or tending to produce deformation in a body. It is measured by the force applied per unit area. SUBSTRATE: A material on whose surface an adhesive substance is spread for bonding or coating. Also, any material which provides a supporting surface for other materials used to support printed wiring patterns. SURFACE RESISTIVITY: The resistance of a material between two opposite sides of a unit square of its surface. It may vary widely with the conditions of measurement. SURFACE SPEED: The linear velocity of a point on the circumference of a drill. Given in units of surface feet per minute sfm. TERMINAL AREA: A portion of a conductive pattern usually, but not exclusively, used for the connection and/or attachment of components. TEST COUPON: A sample or test pattern usually made as an integral part of the printed board, on which electrical, environmental, and micro sectioning tests may be made to evaluate board design or process control without destroying the basic board. TETRA-ETCH*:A nonpyrophoric (will not ignite when exposed to moisture) proprietary etchant. TETROFUNCTIONAL: Describes an epoxy system for laminates that has four cross-linked bonds rather than two and results in a higher glass transition temperature, or Tg . Tg : Glass transition temperature. The temperature at which laminate mechanical properties change significantly. THERMAL CONDUCTIVITY: The ability of a material to conduct heat; the physical constant for the quantity of heat that passes through a unit cube of a material in a unit of time when the difference in temperatures of two faces is 1 C. THERMOPLASTIC: A classification of resin that can be readily softened and resoftened by repeated heating.
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