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G.10
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GLOSSARY
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classification of resin which cures by chemical reaction when tested and, when cured, cannot be resoftened by heating. THIEF: An auxiliary cathode so placed as to divert to itself some current from portions of the work which would otherwise receive too high a current density. THIXOTROPIC: Said of materials that are gel-like at rest but fluid when agitated. THROUGH-HOLE TECHNOLOGY: Traditional printed wiring fabrication where components are mounted in holes that pierce the board. THROWING POWER: A measure of the degree of uniformity with which metal is deposited on an irregularly shaped cathode. Often refers to the ratio of amount of plated metal on the surface of a copper clad board to the amount plated on a side of a hole through the same board. TWIST: A laminate defect in which deviation from planarity results in a twisted arc. UNDERCUT: The reduction of the cross section of a metal foil conductor caused by the etchant removing metal from under the edge of the resist. VAPOR PHASE: The solder-reflow process that uses a vaporized solvent as the source for heating the solder beyond its melting point, creating the component-to-board solder joint. VIA: A metallized connecting hole that provides a conductive path from one layer in a printed wiring board to another. (1) Buried via connects one inner layer to another inner layer without penetrating the surface. (2) Blind via connects the surface layer of a printed wiring board to an internal layer without going all the way through the other surface layer. VOID: A cavity left in the substrate. VOLUME RESISTIVITY: The electrical resistance between opposite faces of a 1-cm cube of insulating materials, commonly expressed in ohm-centimeters. The recommended test is ASTMD 256 51T. Also called the specific insulation. VULCANIZATION: A chemical reaction in which the physical properties of an elastomer are changed by causing the elastomer to react with sulfur or some other cross-linking agent. WATER ABSORPTION: The ratio of the weight of water absorbed by a material to the weight of the dry material. WEAVE EXPOSURE: A condition in which the unbroken woven glass cloth is not uniformly covered by resin. WEAVE TEXTURE: A surface condition in which the unbroken fibers are completely covered with resin but exhibit the definite weave pattern of the glass cloth. WETTING: Ability to adhere to a surface immediately upon contact. WICKING: Migration of copper salts into the glass fibers of the insulating material. WORKING LIFE: The period of time during which a liquid resin or adhesive, after mixing with catalyst, solvent, or other compounding ingredients, remains usable. (See potlife.)
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INDEX
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Acceptability of assembled boards, 52.1 51.39. See also Assembly acceptability Acceptability of fabricated boards, 51.3 51.34. See also Fabricated board acceptability Additive, processes, 5.10, 5.11 Additive circuits, 5.1 5.3, 31.1 31.15 Additive plating, 31.1 31.15. See also Electroless copper plating Adhesives, 40.24, 40.25 Advanced packaging, 4.1 4.30. See also Semi-conductor packaging Chip thinning, 4.11 Enabling technologies, 4.10 4.20 Hybrid Sn-Pb and Pb free, 4.16 Known good die (KGD), 4.10 Lead-free, 4.2, 4.11, 4.16 Multichip modules (MCM), 4.5, 4.6, 13.12 13.14 Multichip packaging, 4.6 4.10 System on a chip (SOC), 4.4, 4.5 ALIVH, 23.18 23.20 American Society for Testing Materials (ASTM), 12.3 ANSI (American National Standards Institute), 6.4, 6.5 ANSI/J-STD-001, 52.4 ANSI/J-STD-002, 42.4, 52.5 ANSI/J-STD-003, 42.4, 52.5 ANSI/J-STD-004, 42.4, 52.5 ANSI/J-STD-005, 42.4, 52.5 Assembled board testing, 54.1 54.12, 55.1 52.20 Alternatives to conventional tests, 55.17 55.19 Approaches, 55.7 55.11 Boundary-scan, 54.6 54.12 Combinational tester, 55.16, 55.17 Defect analyzer, 55.15 Defects, 55.4. 55.6, 55.7 Definitions, 54.2, 55.4 55.6 Design for, 54.1 54.12 Failures, 55.8 Faults, 55.4 55.9 General purpose tester, 55.15, 55.16 IEEE 1149.1, 54.6 In-circuit test, 55.11 55.15 Manufacturing defects, 55.9 55.11 Performance faults, 55.7 55.11 Process of test, 55.2 52.4 Specification faults, 55.11 Standards based, 54.5, 54.11
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Testability, 54.2 54.5 Tester comparison, 55.19 Uses of testing, 55.2 55.4 Assembly acceptability, 52.1 52.39 Cleanliness, 52.32 52.34 Coatings, 52.34, 52.35 Component installation, 52.15 52.24 Adhesives, 52.23, 52.24 Surface-mount, 52.18 52.23 Through-hole, 52.15 52.18 Component types, 52.10 Contamination prevention, 52.9 Conformal coating, 52.34, 52.35 Customer requirements, 52.1, 52.2 Cut traces, 52.37 Physical damage, 52.15 Damage prevention, 52.9, 52.10 Electrical clearance, 52.14, 52.15 ESD, 52.8 Handling to protect, 52.7 52.10 Hardware considerations, 52.10 52.14 IPC-610 acceptance criteria, 52.6, 52.7 Jumper wires, 52.38, 52.39 Laminate condition, 52.32, 52.33 Lead-free soldering, 52.2 Marking, 52.34 Measling and crazing, 52.32, 52.33 Solder-related defects, 52.25 52.32 Solderability related, 52.25 Specifications for, 52.3 52.7 Wire wrap, 52.35 52.37 Workmanship manuals, 52.7 Assembly inspection, 53.1 54.25 Automated, 53.2, 53.3, 53.12 53.16 Automation implementation, 53.23 53.25 Defect definitions, 53.3, 53.4 Density issues, 53.8 Design for, 50.21 Fault definition, 53.3, 53.4 Lead-free impact on, 53.6, 53.7 Post-reflow, 53.17 53.23 Pre-reflow, 53.13 53.17 Process indicators, 53.3, 53.4 Reasons for, 53.4 53.6 Solder joint, 53.8 53.10, 53.13 53.23 Optical, 53.17 53.19 -ray, 53.19 53.23
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