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Laminates (Cont.): Properties used to classify, 8.1 8.16 PTFE, 7.7 Qualification of, 12.1 12.24 Reinforcements, 7.12 7.18 Fiberglass, 7.12 7.17 Non-glass, 7.17 17.18 Nonwoven, 9.6 Resin contents, 9.9 Resin to glass ratio, 9.10 9.12 Resistive foil, 7.25, 9.13 Single-ply versus multiple-ply, 9.7 9.9 Standards, 12. 12.4 Styles, glass and resin combinations, 7.14 Surface resistance, 12.19 Surface resistivity, 8.14, 8.15, 12.16, 12.19 Teflon, 27.6 to 27.8 Testing, 12.1 12.24 Test strategy, 12.4 12.5 Thermal, properties, 8.1 8.4, 10.6, 11.2, 12.16, 12.17 Thermal expansion, 6.10, 8.1 8.4, 10.6, 11.2, 12.16, 12.17 Thermal properties of, 8.1 8.3, Thermal resistance, 12.17, 12.18 Thermal stability, 27.3, 27.4 Thermomechanical tests, 12.12 12.118 Ultraviolet light blockers, 7.9 Thickness, 6.16 Volume resistance, 8.14, 12.19 Water absorption, 8.11, 8.12, 10.6, 10.14, 11.2 11.5, 12.21 See also CAF, Copper foil, Dissipation factor, Drilling Processes, Embedded Components, Epoxy resin systems, Fiberglass, Glass transition temperature, HDI Drilling, High Density Materials, Lead-free, Prepreg Laminate testing, 12.1 12.24 Electrical properties, 12.18 12.20 Thermal properties, 12.12 12.17 Mechanical Properties, 12.9 12.12 Lamination, 27.51 27.61 Lay-up, 27.52 27.54 Stack up, 27.54 Process methods, 27.55 27.59 Vacuum assisted, 27.55, 27.56 Critical variables, 27.56 27.59 Process control, 27.59 27.61 Trouble shooting, 27.59 27.61 Land grid arrays (LGA), 50.1 50.8 Assembly, 50.5 50.7 Design for, 50.8 Elements of, 50.2 50.5 Lead-free issues, 50.1 Rework, 50.7 Laser drilling, 22.5. 22.6, 22.10 22.13, 25.2 25.5 Laser reflow soldering, 47.43 47.53 Alternative types, 47.46, 47.47 Applications, 47.43, 47.44 Coplanarity, 47.50 47.53 Fluxes, 47.52 Fundamentals of, 47.46 47.50
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Laser criteria, 47.46 Lasers, 47.43 47.47 Safety issues, 47.53 Solder joint characteristics, 47.52 Solder sources, 47.52, 47.53 Tooling, 47.47 47.53 Lasers Characteristics, 47.45 Choice of, 47.46 CO2, 25.3, 23.4, 23.10 23.12, 47.46 Elements, 47.44, 47.45 In microvia formation, 25.2 25.6 Drilling, 25.2 25.6, 27.51 In soldering, 43.42 43.54, 47.43 47.50 Ultraviolet (UV), 25.2 25.5 YAG, 23.9 23.12, 25.2, 47.47 Lead-free. See also RoHS Chip attach processing, 4.2, 4.3, 4.11, 4.12 Choosing laminate for, 9.29 9.33, 10.2 10.4, 10.18, 11.1 11.18 Reliability issues, 10.2, 10.3, 10.18 Laminate issues with, 10.4 10.18 See also Reliability Lead-free legislation, 1.1 1.10. See also RoHS Lead-free assembly reliability, 59.1 59.35 Lead-free solder, 47.5 47.11 Lead-free solders, 45.5 45.11 Alternatives, search for, 45.5 Bismuth in, 45.8, 45.9 Candidates for, 45.5 45.11 Elemental candidates, 45.5 45.7 Indium in, 45.10 Temperature ranges of, 45.7 Tin-Gold-Copper (Sn-Au-Cu) (SnAC), 45.9, 45.10 Zinc in, 45.11 Lead-free soldering, 45.1 45.11 Potential solder alloys, 45.5 45.11 Reliability, affect on, 59.1 59.32 See also Solder joint reliability Libraries Physical features, 14.11 Models, 14.11, 14.12 Loss Tangent, 8.8. See also Dissipation factor Machining, 35.1 35.15 Manufacturing Information documentation, 20.1 20.6 Information formats, 20.4 20.7 Manufacturability review, 20.20 20.27 Design rule check, 20.20 20.24 Material standards, A1 A7 MCM (Multichip Modules), types of, 13.12 13.14 Measles, 51.15, 52.32. See also, Multilayer Defects Microvia Conductive inks, 22.33 Conductive paste, 22.33 Drilling of, 11.6. See also High Density Drilling Current carrying capacity, 16.19 Filled via multilayer processing, 27.28 27.37 Hole creation technologies, 23.1 23.15. See also Microvia hole technologies Microvia fabrication, 22.26 22.34. See also HDI Microvia fabrication
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Laser, 22.29 22.33, 23.7 23.22 Photo-via, 22.26 22.29 Plasma, 22.29 Microvia hole technologies ALIVH, 23.18, 23.19 Definitions, 23.1 23.3 Manufacturing process, 23.3 23.23 35 Materials, 23.2 23.5 Multiple layers, 23.11 23.22 Molded circuits, 31.12, 31.13, 5.6 Multichip modules (MCM), 2.12, 4.5, 4.6, 13.12 13.14 Multichip Packages, 4.6 4.10 Chip Scale Packaging (CSP), 4.7,4,8 Known good die (KGD), 4.10, 4.11 Organic substrate, 3.16, 3.17 Partitioned Silicon (Tiling), 3.15, 3.16 Stacked die packages, 3.17 System in a package, 3.18 Three dimensional packaging, 4.9, 4.10 Wafer scale integration (WSI), 4.8 9 Multilayer Adhesion promotion, 27.31, 27.32 Contolled impedance, 27.20, 27.21 Construction types, 27.16 27.37 Basic stack-ups, 27.17 27.28 Blind via, 27.23 27.25 Buried via, 27.22, 27.23 Controlled impedance stack-up, 27.20 27.22 High density, 27.25 27.28 IPC specifications, 27.8 27.10 Odd layer stack-up, 27.19, 27.20 Sequential build-up, 27.22 27.28 Drilling, 27.50, 27.51 Filled via processing, 27.28 27.37 Imaging, 27.29 29.31 Innerlayer materials, 27.20 27.24 Innerlayer processing, 27.24, 27.25 Inspection, 27.31 Lamination, 27.33 27.41. See also Lamination Materials, 27.2 27.16. See also Laminates Critical properties, 27.5 27.10 Electrical properties, 27.4 27.6 Resin systems, 27.1 27.14 Specifications, 27.2 27.5 Thermal properties, 27.6 27.10 Oxide, 27.31, 27.32 Process flow charts, 27.20 27.24 Processing, 27.20 27.25 RoHS compliant, 27.4, 27.5 Silane based adhesion, 27.50 Specifications and standards, 27.2, 27.3 Stack-up, 27.16, 27.17 Tooling, 27.25 27.29 Tooling hole formation, 27.27, 27.28 Tooling system, 27.28, 27.29 Multilayer board processing, 27.37 27.51. See also Lamination Flowcharts, 27.37, 27.38 Innerlayer materials, 27.37 27.40 Copper foil, 27.38, 27.39 Innerlayer process, 27.40 27.42
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Tooling, 27.42 27.45 Tooling system, 27.45, 27.46 Imaging, 27.46, 27.47 Adhesion promotion, 27.49 27.50 Autoclave, 27.35 B-stage, 27.37 27.39 Flow, 27.37 Cure, 27.37, 27.38 Variables, 27.38 Buried and Blind vias, 27.39 Hydraulic press, 27.35 Lay-up, 27.34. 27.35 Materials, 27.34, 27.35 Process control, 27.39 27.41 Process methods, 27.35 Stack-up, 27.35 Temperature/pressure cycle, 27.36 27.38 Troubleshooting, 27.39 27.41 Vacuum-assisted, 27.35 Variables, 27.35 27.38 See also Imaging Multilayer boards (MLB). See also Multilayer NEMA grades, 6.2 6.19, 12.3 Nickel Electroless, 32.4 32.7 Electroplated, 29.23 29.25 No-clean soldering 46.7 46.9 ODB++, 18.18, 18.19, 20.6 Odd form components, 40.42 40.48 Optical interconnects, 3.18 3.21 Organic Solderability Preservative (OSP), 32.2, 32.3 OSP, Lead-free impact of, 43.5 Oven reflow soldering Forced-air convection ovens, 40.37 40.39, 47.7, 47.10 Infrared (IR), 47.2 47.7 Lead-free issues, 47.15 Oven characteristics, 43.20, 43.21 Oven diagnostic board, 47.16 Oven subsystems, 47.2 47.7 Product profile board, 47.16 47.24 Reflow atmosphere, 46.12 46.16 Reflow profile, 47.11 47.14 Reflow profiler, 47.16 43.24 Subsystems, 47.2 47.7 Success in, 47.14, 47.15 Thermocouple, use of, 47.18 47.24 Thermometry, 47.16 47.24 Oxide treatment, 27.49, 27.50. See also Multilayer boards Package reliability, 54.23. See also Solder joint reliability Packaging. See Electronic Packaging Packaging levels, 13.9 Pad Array Carrier (PAC), 3.8 3.11, 3.17 Pads, density, effect on, 2.16 2.18 Palladium, electroless, 32.5 32.7 Palladium plating, 29.27 Panel Plating, 5.13 Pattern plating, 5.11 5.13
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