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INDEX
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Solder mask (Cont.): Dry film masks, 32.16 Halogen free, 33.6 Issues for, 33.2, 32.3 Legend properties, 33.19, 33.20 Liquid masks, 32.10 33.16 Non-imageable, 33.16, 33.17 RoHS issues, 33.3, 33.5 Terminology, 33.1 Types of, 33.3, 33.4 Selection of, 33.4, 33.5 Surface finish compatibility, 33.8, 33.9 Surface preparation, 33.9, 33.10 Via protection, 33.18, 33.19 Solderability Testing, 43.1 43.25, 51.22, 52.23 ANSI/J-STD-001, 43.4, 49.3 ANSI/J-STD-002, 43.4, 49.3, 43.25 ANSI/J-STD-003, 43.4, 49.4 Component solderability, 43.22 43.22 Definitions, 43.5 Design for, 42.3, 42.4 Failure mode by surface finish, 43.16 43.22 Gauge repeatability and reproducibility, 43.9 43.11 Globule testing, 43.15 Lead-free soldering, 43.6 Plated through hole, 43.20 43.23 Surface finishes, 43.16 43.22 Temperature, influence on, 43.13 Testing for, 43.8 43.13 Wetting, 43.6 43.8 Wetting balance, 43.9, 43.15 Soldering, 43.1 43.67 Atmospheres, 46,12 46.16 Basics, 44.11 44.14 Conduction soldering, 40.40, 40.41 Connection to board, 44.4, 44.6 Connection to component, 44.6 44.9 Fluxes, 43.1 43.13 Fluxless, 46.14 Fundamentals, 44.3 44.14 Gaseous fluxing, 46.14 Hot-bar soldering, 47.53 47.58 Hot-gas soldering, 47.58, 47.59 Intermetallic formation, 43.7, 43.9 Laser reflow soldering, 47.43 47.53 Lead -free, 45.1 45.9 Component leads, 44.6 44.9 Mass soldering, 47.1 Oven reflow, 47.2 47.28 Overview, 44.10, 44.11 Pin-in-paste, 47.24 47.28 Plated through hole, 44.5, 44.6 Repair, 48.1 48.7 Rework, 48.1 48.7 Solder joint elements, 44.4 Ultrasonic soldering, 47.59, 47.60 Vapor-phase reflow, 47.42, 47.43 Wave soldering, 47.28 47.42 Wetting, 42.6, 43.7 See also Fluxes, Laser reflow soldering, Lead-free soldering, Oven reflow soldering, Wave soldering
Recognizing QR Code In None
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QR-Code Drawer In C#.NET
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Solder paste dispensing, 40.26 40.32 Solder resist. See Solder Mask Solder shock, 12.7 Subtractive, processes, 5.10, 5.11 Subtractive circuits, 5.2, 5.3 Surface finishes, 32.1 32.10, 45.11 45.19 Alternatives, list of, 32.3 Assembly compatibility, 32.14 32.17 Black pad, 32.7, 58.19, 58.20 Capability summary, 32.2 Comparison of alternatives, 32.32 Electroless Nickel/immersion gold (ENIG), 32.6, 32.7, 45.14, 45.15, 58.17 58.20 Electrolytic Nickel/electrolytic gold, 45.12, 45.13 Failure modes, 32.19 32.21 High speed signals, 32.18 Hot air solder level (HASL), 32.4, 32.5, 45.11, 45.12 Immersion silver, 32.10, 32.11, 45.15, 45.16 Kirkendall voids, 58.17 58.22 Lead-free issues, 58.20, Lead-free issues, 32.1 Organic Solderability Preservative (OSP), 32.8 32.10, 45.12 Other alternatives, 32.13, 32.14 Press fit, 32.19 Purpose and function, 32.1 32.3 Reliability test, 32.17, 32.18 Reliability, affect on, 58.16 58.22 Silver, immersion, 32.10, 32.11 Solder joint metallurgy, 32.16 Solder on pad (SOP), 58.20 58.22 Technology drivers, 32.2, 32.3 Tin, 32.11 32.12, 45.16 45.19 Wirebonding, 32.18, 45.16 Surface laminar circuit (SLC), 1.14, 22.4, 23.4 23.7 Surface-mount assembly, 40.16 40.42 Adhesives, 40.24, 40.25 Components available for, 40.21 40.24 Component placement, 40.32 40.37, 40.50, 40.51 Design for, 40.19 Direct chip attach, 2.12 Dispensing processes, 40.23 40.32, 40.49 Equipment selection, 40.54 40.57 Fiducials, 20.23, 40.36 Hand soldering, 40.40 Lead-free soldering, 40.41, 40.42 Machine vision technology, 40.35 40.37 Manual assembly, 40.25 Network communications, 40.53, 40.54 Modular line, 40.19 Odd-form assembly, 40.42 40.48 Automation, 40.44 Equipment, 40.47 Manual, 40.43, 40.44 Placement machines, 40.32 40.37 Process control, 40.48 40.54 Processes for, 40.19 40.41 Repair and rework, 40.57 40.64 RoHS issues, 40.18 Stencil, 40.27, 40.28
Creating QR Code 2d Barcode In .NET
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Encode QR In .NET Framework
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INDEX
Denso QR Bar Code Generation In Visual Basic .NET
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Drawing EAN / UCC - 14 In None
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I.15
Generating Code128 In None
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Code 39 Creation In None
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Soldering processes, 40.37 40.41, 40.51 40.53. See also Solder Techniques Ultra-high-speed line, 40.19 Surface mount components, 3.1 3.20, 4.1 4.20 System on a Chip (SOC), 4.4, 4.5 System-in-a-package (SOP), 4.3 4.5 TAB (Tape Automated Bonding), 2.12, 4.12, 13.16, 13.17 Tape automated bonding (TAB), flexible circuit issues, 60.13, 60.14 Tensile strength, 12.7 Tent and etch, 34.13, 34.16 Testing. See Assembled board testing, Bare board testing Tg. See Glass transition temperature Thermal management, 2.8 Thermal performance, design for, 17.1 17.18 Component parameters, 17.16, 17.17 Component spaces, 17.9, 17.10 Conducting heat to chassis, 17.12 17.14 Current carrying capacity of traces, 16.1 16.22 Heat sink attach, 17.14, 17.15 Modeling thermal performance, 17.15 17.17 Optimizing the PCB, for, 17.3, 17.4 PCB as heat sink, 17.2, 17.3 Smearing layers, 17.17, 17.18 Trace layout impact, 17.3 17.5 Thermal planes, 17.5 17.7 Thermal saturation, 17.10, 17.11 Thermal vias, 17.7 17.9 See also Current carrying capacity Thermomechanical analysis (TMA), 27.7 Time domain reflectometry (TDR), 37.10, 37.11 Tin, immersion, 32.8 32.10 Tin Electroplating, 29.22, 29.24, 33.3, 33.5, 33.6 Tin pest, 45.19 Tin whiskers, 32.20, 45.17, 45.18 TMA (Thermomechanical analysis), 12.10 12.14, 27.7 27.9 Tooling Multilayer, 27.25 27.29 Soft, 20.1, 20.2 Trace Acceptance criteria, 51.16 51.18 Coupling, 13.8 Electric characteristics, 13.4 13.6 Resistance, 13.6, 13.7
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Ultrasonic soldering, 47 59, 47.60 Underwriters Laboratories (UL), 12.18 Categories, 8.12 Underfill, 3.12, 40.64 40.66 Vapor phase reflow soldering, 40.39, 40.40, 47.42, 47.3 Wafer Scale Integration (WSI), 3.17 Waste Electrical And Electrical Equipment (WEEE), 1.1 Waste minimization and treatment Alternative treatment, 60.7, 60.8, 60.18 60.21 Alternative treatments compared, 60.26 Chemical treatment systems, 60.21 60.26 Definitions, 60.6 60.8 Major sources of waste, 60.5, 60.6 Photoresist stripping, 60.20 Pollution prevention techniques, 60.6 60.11 Dragout reduction, 60.13 Extended bath life, 60.11 60.13 Material substitution, 60.14, 60.15 Rinse water, 60.9 60.11 Recycling and recovery, 55.7, 55.15 55.18 Wave soldering, 40.12 40 15, 40.39, 47.28 47.42 Basics of, 47.28, 47.29 Contaminants, 47.34 Defects, 47.39, 47.40 Design for, 47.35, 47.36 47.38, 47.39 Diagnostics, 47.32, 47.33 Dross, 47.33, 47.34 Flux application, 43.33, 43.34 Fluxers, 47.29 47.31 Hygiene, 47.34 Lead-free issues, 47.40, 47.41 Machine subsystems, 47.29 47.32 Pallets, 47.36 47.38 Welding, 44.10 Wetting balance test, 43.1 43.24 Wire-bonding, 3.12, 4.12 X-ray inspection, 53.19 53.23 YAG laser, 23.10 23.12 Yield Conductor width effect on, 2.19 2.21 Prediction, 19.4 19.6
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Bar Code Creation In None
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Recognizing USS Code 128 In C#
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Paint UPCA In Java
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UCC - 12 Generation In Objective-C
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Decode Code 3 Of 9 In Visual Studio .NET
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Data Matrix Generator In Visual Studio .NET
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Code 39 Extended Generator In VB.NET
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