how to use barcode scanner in asp.net c# BASE MATERIALS PERFORMANCE ISSUES in Software

Draw QR Code ISO/IEC18004 in Software BASE MATERIALS PERFORMANCE ISSUES

BASE MATERIALS PERFORMANCE ISSUES
Quick Response Code Reader In None
Using Barcode Control SDK for Software Control to generate, create, read, scan barcode image in Software applications.
Creating QR In None
Using Barcode generation for Software Control to generate, create QR Code ISO/IEC18004 image in Software applications.
TABLE 9.7 Dielectric Constants and Dissipation Factors of Common Resin/Reinforcement Composites Resin System Epoxy Epoxy Halogen-Free Epoxy Epoxy/PPO Modified Epoxy Epoxy Blend Epoxy Blend Low-Loss Blend Very-Low-Loss Blend Cyanate Ester Polyimide APPE PTFE Hydrocarbon Reinforcement E-Glass Aramid Fiber E-Glass E-Glass E-Glass E-Glass SI -Glass E-Glass E-Glass E-Glass E-Glass E-Glass E-Glass E-Glass/Ceramic Dk @ 1 MHz 4.4 3.9 4.3 3.9 3.9 3.9 3.6 3.8 3.5 3.8 4.3 3.7 2.3 3.4 Dk @ 1 GHz 3.9 3.8 4.0 3.9 3.7 3.7 3.4 3.7 3.4 3.7 3.9 3.4 2.3 3.3 Df @ 1 MHz 0.020 0.024 0.015 0.011 0.012 0.009 0.008 0.006 0.003 0.008 0.014 0.005 0.0013 0.0025 Df @ 1 GHz 0.018 0.020 0.013 0.010 0.012 0.009 0.008 0.007 0.0036 0.011 0.015 0.007 0.0009 0.0024
Denso QR Bar Code Reader In None
Using Barcode decoder for Software Control to read, scan read, scan image in Software applications.
Generate Quick Response Code In C#
Using Barcode printer for VS .NET Control to generate, create QR Code ISO/IEC18004 image in VS .NET applications.
Table 9.7 lists values for approximately 50 percent resin content. These values change as the resin content varies, with the magnitude of the change depending on the specific resin system. Also, comparable resin system types from various suppliers could differ. For example, since there are many types of epoxies, with a wide range of electrical properties, specific epoxy formulations from different material suppliers can exhibit somewhat different dielectric and loss properties. In addition, the test method used to measure Dk and Df, especially at higher frequencies, will have a significant impact on the reported value. When comparing materials, it is critical to compare values derived from the same test method, or at least to understand the differences in the test methods.The differences in test methods are beyond the scope of this chapter, but their importance should not be underestimated.The purpose of this table is to highlight the relative differences between various resin systems and reinforcement types. These values also vary with resin content and frequency. Figure 9.27 illustrates the resin content dependence of the dielectric constant for a few materials. Figure 9.28 shows the impact of resin content on the dissipation factor of the low Dk epoxy blend, and Fig. 9.29 shows the impact of frequency on Dk for a few of these materials. Beyond frequency and resin content effects, the dielectric constant and dissipation factor can vary with temperature and moisture absorption.
Quick Response Code Printer In .NET Framework
Using Barcode drawer for ASP.NET Control to generate, create QR Code 2d barcode image in ASP.NET applications.
Drawing QR Code JIS X 0510 In .NET
Using Barcode generator for .NET framework Control to generate, create Denso QR Bar Code image in .NET applications.
Dielectric constant versus Resin content 5.5 5 Dk at 1 MHz 4.5 4 3.5 3 30
Create QR Code In Visual Basic .NET
Using Barcode printer for .NET Control to generate, create QR Code image in Visual Studio .NET applications.
EAN128 Maker In None
Using Barcode generator for Software Control to generate, create EAN128 image in Software applications.
FIGURE 9.27
UPC-A Supplement 5 Generation In None
Using Barcode drawer for Software Control to generate, create UPC-A Supplement 5 image in Software applications.
DataMatrix Printer In None
Using Barcode generation for Software Control to generate, create DataMatrix image in Software applications.
Epoxy Low Dk epoxy blend Cyanate ester
Drawing Code-39 In None
Using Barcode creation for Software Control to generate, create Code 39 image in Software applications.
Code 128A Creation In None
Using Barcode encoder for Software Control to generate, create Code-128 image in Software applications.
50 Resin content (%)
Paint EAN8 In None
Using Barcode encoder for Software Control to generate, create EAN 8 image in Software applications.
Generating Code 128C In None
Using Barcode encoder for Microsoft Excel Control to generate, create Code-128 image in Office Excel applications.
Dielectric constant versus resin content.
Code 39 Extended Printer In None
Using Barcode printer for Online Control to generate, create Code 3/9 image in Online applications.
Bar Code Recognizer In C#
Using Barcode Control SDK for .NET framework Control to generate, create, read, scan barcode image in VS .NET applications.
PRINTED CIRCUITS HANDBOOK
Barcode Printer In None
Using Barcode generation for Font Control to generate, create barcode image in Font applications.
DataMatrix Generator In Java
Using Barcode drawer for Android Control to generate, create ECC200 image in Android applications.
Dissipation factor versus Resin content 0.015 Df at 1 MHz 0.01 0.005 Low Dk epoxy blend 0 30
UPC A Creator In VS .NET
Using Barcode generator for Reporting Service Control to generate, create UPC Symbol image in Reporting Service applications.
DataMatrix Scanner In Visual C#
Using Barcode scanner for .NET Control to read, scan read, scan image in Visual Studio .NET applications.
FIGURE 9.28
50 Resin content (%)
Dissipation factor versus resin content for a low Dk epoxy blend.
When choosing a material for a specific application, it is important to understand the operating conditions and environment in which the circuit will be used. Some resin systems exhibit less sensitivity to these conditions than others. For example, base material suppliers are continually developing resin systems to meet the demanding electrical properties requirements of high-speed and wireless applications, which include consistent properties over frequency ranges and environmental conditions. In short, different material types can have different responses to changes in frequency, resin content, temperature, and humidity conditions. These responses become more important to understand in high-speed, RF, and wireless applications. In addition, when selecting a material, it is important not simply to select the material with the lowest dielectric constant or dissipation factor, since there are typically cost-performance trade-offs to be made. In general, the lower the dielectric constant and dissipation factor, the more costly the material, and very often the more difficult it is to process. In summary, some general relationships include the following:
The dielectric constant generally decreases with increasing resin content. The dissiption factor often increases with increasing resin content. The dielectric constant typically drops as frequency increases. The dielectric constant and dissipation factor typically increase as water absorption rises.
Dielectric constant versus Frequency 5.5 Epoxy 5 Dk 4.5 4 3.5 3 1 MHz 2 GHz Frequency
FIGURE 9.29 Dielectric constant versus frequency.
Low Dk epoxy blend APPE
5 GHz
10 GHz
BASE MATERIALS PERFORMANCE ISSUES
The dielectric constant of E-glass is only mildly frequency-dependent and therefore lower resin contents result in less variation across frequencies. The dissipation factor generally rises with frequency, but may exhibit maxima at certain frequencies.
Electrical Performance of Lead-Free Compatible FR-4 Materials Most of the FR-4 laminate materials developed for lead-free assembly applications use an alternative resin chemistry in comparison to the conventional dicyandiamide ( dicy ) cured FR-4s. The most common alternatives are commonly referred to as phenolic or novolac cured materials. Although there is some variation between these materials, as a group they tend to exhibit somewhat different electrical performance, particularly with respect to dielectric loss, or Df. For most applications operating in typical frequency ranges, the differences are not significant. However, as operating frequencies increase toward the higher end of FR-4 applications and impedance control becomes more critical, these differences can become very significant. Table 9.8 includes two common dicy-cured FR-4 materials (A and C) and two phenolic FR-4 materials compatible with many lead-free assembly applications (B and D). It also includes a lead-free compatible material (E) designed to improve Dk and Df performance in comparison to the phenolic lead-free compatible materials. Note that different types of measurement systems can result in different measured values for Dk and Df. Laminate resin contents and other factors also influence these properties. Thus, in Table 9.8 the comparisons between these materials are more important than the absolute values reported for each material. For these comparisons, the same measurement system and resin contents were used.
TABLE 9.8 Properties of Several Base Material Types Glass Transition Temp., C 140 150 175 175 200 % Expansion, 50 260 C (40% RC) 4.2 3.4 3.5 2.8 2.8
Copyright © OnBarcode.com . All rights reserved.