how to use barcode scanner in asp.net c# R-4 ce d F in Software

Encode Denso QR Bar Code in Software R-4 ce d F

R-4 ce d F
Decode QR-Code In None
Using Barcode Control SDK for Software Control to generate, create, read, scan barcode image in Software applications.
Create QR-Code In None
Using Barcode generation for Software Control to generate, create Quick Response Code image in Software applications.
210
Recognize QR In None
Using Barcode recognizer for Software Control to read, scan read, scan image in Software applications.
Quick Response Code Generation In C#
Using Barcode printer for VS .NET Control to generate, create Denso QR Bar Code image in Visual Studio .NET applications.
Typical Lead-free Sn/Pb assembly assembly temperature temperature range range 240 C-270 C 210 C-245 C
QR Generation In .NET
Using Barcode printer for ASP.NET Control to generate, create QR Code ISO/IEC18004 image in ASP.NET applications.
Print Denso QR Bar Code In VS .NET
Using Barcode encoder for VS .NET Control to generate, create QR Code ISO/IEC18004 image in Visual Studio .NET applications.
270 320 350 Temperature C
QR Code Generator In Visual Basic .NET
Using Barcode generator for Visual Studio .NET Control to generate, create Denso QR Bar Code image in Visual Studio .NET applications.
Barcode Drawer In None
Using Barcode maker for Software Control to generate, create bar code image in Software applications.
400
UCC - 12 Creator In None
Using Barcode creator for Software Control to generate, create EAN / UCC - 13 image in Software applications.
Make Data Matrix 2d Barcode In None
Using Barcode printer for Software Control to generate, create Data Matrix 2d barcode image in Software applications.
FIGURE 10.3 material.
Code 128C Drawer In None
Using Barcode drawer for Software Control to generate, create Code-128 image in Software applications.
Making UPC-A Supplement 2 In None
Using Barcode drawer for Software Control to generate, create UPC-A Supplement 5 image in Software applications.
Decomposition curves for a traditional and improved FR-4
Generating 2/5 Interleaved In None
Using Barcode maker for Software Control to generate, create Uniform Symbology Specification ITF image in Software applications.
GS1 - 13 Creation In Visual Studio .NET
Using Barcode encoder for ASP.NET Control to generate, create GS1 - 13 image in ASP.NET applications.
This seemingly small level of decomposition in the conventional products can have extremely significant effects on reliability, especially if multiple thermal cycles are experienced. On the other hand, as long as the temperatures experienced during assembly and rework do not exceed the temperature at which decomposition begins, there may not be further benefit to higher decomposition temperatures. In addition, the resin system modifications often made to increase Td can sometimes lead to other problems, such as brittleness or hardness of the resin system that negatively impacts PCB manufacturability (as in drilling, scoring, and routing) or fracture toughness in tight pitch PTH areas. As not all lead-free-compatible materials use the same resin systems, great care should be used in selecting a material that balances the requirements of the OEM, assembler, and PCB fabricator. A simple review of a material data sheet or IPC slash sheet is not sufficient to guarantee success. Involvement with the base material supplier to understand fully the capabilities of a material and the processing required for success is even more important for lead-free applications. To expand on this, examine Figs. 10.4 through 10.6, which were also presented in Chap. 8. First, note the slope of the decomposition curve in Fig. 10.6. By the 5 percent decomposition definition, this material has a Td of 405 C. However, looking at 1 percent and 2 percent values, the temperatures are 336 C and 367 C, which are significantly lower than a reported 5 percent value of 405 C. This is not to say that a 1 percent Td of 336 C is bad. In fact, this material has exhibited exceptional reliability in lead-free applications. However, it does point to the need to understand decomposition levels other than the 5 percent level. In contrast, the material in Fig. 10.5 has a 5 percent Td of 330 C with 1 percent and 2 percent Td s of 326 C and 328 C, respectively. In this case, there is a very small difference between the 1 percent, 2 percent, and 5 percent values, and this material has also proven to have excellent performance in a broad range of leadfree assembly applications. Last, the standard high-Tg material in Fig. 10.4 exhibits a 5 percent Td of 305 C with 1 percent and 2 percent values of 297 C and 301 C. This is also a small range of values, but in this case the absolute values are lower and begin to approach the range of temperatures that can be experienced, at least locally, in a printed circuit board that undergoes lead-free assembly and rework. Materials such as this have not performed with adequate reliability to be considered for anything but the simplest lead-free applications. In addition, if PCBs made with these materials are stored in uncontrolled environments and are allowed to absorb even a modest level of moisture, the combination of lower Td s with the higher vapor pressure of water at lead-free temperatures can lead to catastrophic defects in assembly or severely degraded long-term reliability. To take this a step further, examine the materials listed in Table 10.3. These are four FR-4 materials, with material C being the same material as shown if Fig. 10.4, and material D being
UPC - 13 Recognizer In Visual C#
Using Barcode scanner for .NET Control to read, scan read, scan image in VS .NET applications.
Generate UPC-A In Objective-C
Using Barcode creator for iPhone Control to generate, create UCC - 12 image in iPhone applications.
THE IMPACT OF LEAD-FREE ASSEMBLY ON BASE MATERIALS
Code39 Maker In Visual C#.NET
Using Barcode creator for .NET framework Control to generate, create Code 39 Full ASCII image in VS .NET applications.
Print DataMatrix In Objective-C
Using Barcode generator for iPad Control to generate, create DataMatrix image in iPad applications.
100 300.81 C 97.96% Weight (%)
Generate UPC-A Supplement 2 In Visual Studio .NET
Using Barcode creation for .NET Control to generate, create GS1 - 12 image in .NET applications.
Recognizing Barcode In .NET
Using Barcode decoder for .NET Control to read, scan read, scan image in .NET applications.
297.83 C 297.02 C 98.96% 304.33 C 94.98%
70 0 100 200 300 Temperature ( C) 400 500 Universal V4.1D TA
FIGURE 10.4 Decomposition curve for a standard dicy-cured high-Tg FR-4.
the same as the material in Fig. 10.5. The impact of decomposition temperature when these materials are exposed to multiple thermal cycles to different peak temperatures is highlighted in Figs. 10.7 and 10.8. Figure 10.7 graphs cumulative weight loss (decomposition) for these materials when cycled repeatedly to a peak temperature of 235 C. Clearly, there is little impact on
329.29 C 326.48 C 99.03% 328.43 C 98.02% 330.37 C 94.99%
Weight (%)
Copyright © OnBarcode.com . All rights reserved.