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1. Brist, Gary, Hall, Stephen, Clauser, Sidney, and Liang, Tao, Non-Classical Conductor Losses Due to Copper Foil Roughness and Treatment, ECWC 10/IPC/APEX Conference, February 2005. 2. Bergum, Erik, Application of Thermal Analysis Techniques to Determine Performance of Base Materials through Assembly, IPC Expo Technical Conference Proceedings, Spring 2003. 3. Kelley, Edward, An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability, IPC/Soldertec Conference, Amsterdam, June 2004. 4. Hoevel. Dr. Bernd, Resin Developments Targeting Lead-Free and Low Dk Requirements, EIPC Conference, 2005. 5. Christiansen, Walter, Shirrell, Dave, Aguirre, Beth, and Wilkins, Jeanine, Thermal Stability of Electrical Grade Laminates Based on Epoxy Resins, IPC Printed Circuits Expo, Anaheim, CA, Spring 2001. 6. Kelley, Ed, Bergum, Erik, Humby, David, Hornsby, Ron, Varnell, William, Lead-Free Assembly: Identifying Compatible Base Materials for Your Application, IPC/Apex Technical Conference, February 2006. 7. St. Cyr, Valerie A., New Laminates for High Reliability Printed Circuit Boards. Proceedings of IPC Technical Conference, February, 2006 8. Freda, Michael, and Furlong, Jason, Application of Reliability/Survival Statistics to Analyze Interconnect Stress Test Data to Make Life Predictions on Complex, Lead-Free Printed Circuit Assemblies, EPC 2004, October 2004. 9. Brist, Gary, and Long, Gary, Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection, ECWC 10/APEX/IPC Conference, February 2005. 10. Ehrler, Sylvia, Compatibility of Epoxy-Based PCBs to Lead-Free Assembly, EIPC Winter Conference, 2005, Circuitree, June 2005. 11. IST procedure developed and offered through PWB Interconnect Solutions, Inc., www.pwbcorp.com.
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SELECTING BASE MATERIALS FOR LEAD-FREE ASSEMBLY APPLICATIONS
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11.1 INTRODUCTION
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10 discussed the impact of lead-free assembly on printed circuit boards (PCBs) and base materials, and also discussed many of the critical base material properties relevant to performance in lead-free applications. These properties included:
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Decomposition temperature (Td) Glass transition temperature (Tg) Coefficients of thermal expansion (CTEs) Moisture absorption Time to delamination, such as T260 and T288 tests
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Also, the need to achieve the right balance of properties with ease of use in the PCB fabrication process, in addition to the requirements of assemblers and original equipment managers (OEMs), was highlighted. This is the result of the impact that PCB fabrication can have on the performance of the material and finished PCB during assembly and in end-use application.A given material type offers a certain level of performance in the finished PCB. However, this level of performance may or may not be realized, depending on how the materials were processed during fabrication. This makes it extremely complicated to make general recommendations on what material should be used in a given application. However, this chapter describes an approach that has been used quite successfully in addressing this question. But first, some of the PCB fabrication and assembly issues that can affect performance are outlined.
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11.2 PCB FABRICATION AND ASSEMBLY INTERACTIONS1
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The reliability of the assembled PCB in the end-use application is a function not only of the base materials selected, but how the materials were processed during PCB fabrication and component assembly. Different base material types may require different processing conditions in
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PRINTED CIRCUITS HANDBOOK
order to achieve the best results in the finished product. In reviewing these items, understand that these are general considerations that should be evaluated within the context of the specific fabrication and assembly processes and with regard to the specific materials being considered. The specific requirements for long-term reliability must also be considered. So while it is not possible to give exact, optimal processing conditions for all applications, the items that follow represent parameters that should be considered as products are converted to lead-free assembly.
PCB Fabrication Considerations As just stated, selecting the appropriate base material for a given application is only one of several key issues when converting to lead-free assembly. Several factors related to PCB fabrication are also critical.
Moisture Absorption As discussed in Chap. 10, a given level of moisture absorption can be much more serious in lead-free assembly applications than it is for conventional tin-lead assembly applications. This is due to the increase in water vapor pressure at the higher temperatures of lead-free assembly. Figure 11.1 is a graph showing the vapor pressure of water versus temperature. At lead-free assembly temperatures, the pressure is much higher, which causes substantially more stress within the laminate and on the interfaces within the PCB, including resin-glass, resin-oxide, resin-copper, and resin-resin interfaces. As a result, additional drying or baking processes may be needed to drive off moisture prior to processes involving thermal cycles. 11.2.2.1 PCB Construction and CTE Values. While all PCB constructions contain some level of CTE mismatch between each of the layers, the total amount of expansion and stress at the interfaces are greater in lead-free applications due to the higher temperatures involved. So even though the CTE values may be the same for a given construction, transitioning a part from standard tin-lead assembly to lead-free assembly results in greater levels of stress within the PCB. In some cases, this increased stress can lead to defects such as delamination, especially if combined with the increased stress resulting from any absorbed moisture. These thermal expansion-related stresses can be most severe in hybrid constructions where two or more different types of base material are used in the same construction, particularly if the
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